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Invalid wafer grinding device

A technology of grinding device and wafer, applied in grinding device, grinding machine tool, grinding/polishing equipment, etc., to achieve the effect of improving uniformity, avoiding waste of grinding liquid and improving grinding uniformity

Pending Publication Date: 2020-05-15
YANGTZE MEMORY TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] The technical problem to be solved by the present invention is how to improve the uniformity of grinding and reduce the waste of grinding liquid when grinding invalid wafers

Method used

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  • Invalid wafer grinding device
  • Invalid wafer grinding device
  • Invalid wafer grinding device

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Embodiment Construction

[0034] As mentioned in the background art, when the existing invalid wafer grinding device grinds the invalid wafer, it is easy to cause problems such as uneven grinding and great waste of polishing fluid.

[0035] The study found that when using the existing invalid wafer grinding device to grind the invalid wafer, the grinding fluid is manually added, and the amount of grinding fluid added and the flow rate of the grinding fluid are difficult to control, which easily leads to waste of grinding fluid and insufficient grinding. In addition, one hand needs to be used to press the back of the failed wafer during grinding, and the other hand is required to add the grinding liquid, which is not conducive to grinding with both hands, and further affects the uniformity of grinding the failed wafer.

[0036]For this reason, the present invention provides a kind of failure wafer grinding device, comprises: grinding table, and described grinding table has grinding surface, is used for g...

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Abstract

The invention provides an invalid wafer grinding device. The invalid wafer grinding device comprises a grinding table provided with a grinding surface and used for grinding the to-be-ground surface ofan invalid wafer, and a grinding fluid automatic dripping unit used for evenly dripping grinding fluid onto the grinding surface of the grinding table when the grinding table carries out grinding onthe to-be-ground surface of the invalid wafer. The grinding fluid automatic dripping unit can evenly drip the grinding fluid onto the grinding surface of the grinding table when the grinding table carries out grinding on the to-be-ground surface of the invalid wafer. Thus, the invalid wafer grinding device can accurately control the dripping rate and dripping quantity of the grinding fluid to prevent waste of the grinding fluid through manual dripping and can improve the grinding evenness of the invalid wafer. When the reverse side of the invalid wafer needs to be pressed during grinding, an operator or an inspector can press the reverse side of the invalid wafer with the two hands so as to improve the grinding evenness of the invalid wafer.

Description

technical field [0001] The invention relates to the field of failed wafer detection, in particular to a failed wafer grinding device. Background technique [0002] Generally speaking, chip failure is inevitable in the process of development, production and use. With the continuous improvement of people's requirements for product quality and reliability, failure analysis is becoming more and more important. Through chip failure analysis, it can help IC designers find design defects, mismatch of process parameters, or design and operation Inappropriate and other issues. Specifically, the significance of failure analysis is mainly manifested in the following aspects: failure analysis is a necessary means to determine the failure mechanism of chips; failure analysis provides necessary information for effective fault diagnosis; failure analysis provides design engineers with continuous improvement or repair of chips. The design can provide the necessary feedback information to ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B24B37/10B24B37/34B24B57/02
CPCB24B37/10B24B37/34B24B57/02
Inventor 李品欢仝金雨
Owner YANGTZE MEMORY TECH CO LTD
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