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Heat conduction device

A technology of heat conduction and devices, applied in the field of heat conduction, can solve the problems of low heat dissipation efficiency and unsatisfactory heat dissipation effect of heat sinks, achieve good heat dissipation effect, small cavity volume, and overcome low heat transfer density

Active Publication Date: 2020-05-15
李居强
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The purpose of the present invention is to solve the problems of low heat dissipation efficiency and unsatisfactory heat dissipation effect of existing heat sinks, and provide a heat conduction device with higher heat transfer density, better heat dissipation efficiency and effect

Method used

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  • Heat conduction device
  • Heat conduction device
  • Heat conduction device

Examples

Experimental program
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Effect test

Embodiment 1

[0028] Such as Figure 1 to Figure 5 As shown, a heat conduction device includes a heat conduction block 1 and a heat pipe 2 . One side of the heat conduction block 1 is provided with a heat transfer boss 3 . A cavity 4 is arranged inside the heat conduction block 1 . The cavity 4 is filled with working fluid. Several heat exchange fins 5 are arranged on the inner wall of the cavity 4 near the heat transfer boss 3 . The heat exchange fins 5 are made of aluminum. The heat pipe 2 passes through the heat conduction block 1 . A section of the heat pipe 2 passing through the heat conduction block 1 is close to the cavity 4 .

[0029] The heat conduction block 1 is provided with a filling port 6 . The filling port 6 includes a first filling channel 7 arranged on the heat conduction block 1 . One end of the first filling channel 7 communicates with the cavity 4 , and the other end passes through the heat conducting block 1 . The heat conduction block 1 is provided with a colu...

Embodiment 2

[0032] Such as Figure 6 to Figure 7As shown, the difference between Embodiment 2 and Embodiment 1 is that in Embodiment 2, the filling port 6 includes a second filling channel 23 , a tapered cavity 24 , a threaded hole 25 , and an elastic body 27 . The second filling channel 23 , the tapered cavity 24 and the threaded hole 25 are all arranged on the heat conducting block 1 . One end of the second filling channel 23 communicates with the cavity 4 , and the other end connects with the tapered cavity 24 . An end of the tapered cavity 24 away from the second filling channel 23 is connected with a threaded hole 25 . The threaded hole 25 passes through the heat conduction block 1 . The elastic body 27 is a cylinder. The elastic body 27 is made of silicone. One end of the elastic body 27 is close to the surface of the tapered cavity 24 , and a threaded sleeve 26 is threaded in the threaded hole 25 . The screw sleeve 26 is cylindrical, and one end of the screw sleeve 26 is close...

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Abstract

The invention discloses a heat conduction device which comprises a device body and a heat pipe, a cavity is formed in the device body and is filled with a working fluid, the heat pipe penetrates through the device body, and one section of the heat pipe abuts against the cavity. The heat conduction device is high in heat dissipation efficiency and good in heat dissipation effect.

Description

technical field [0001] The invention relates to the technical field of heat conduction, in particular to a heat conduction device. Background technique [0002] As the power of an electronic product increases, the heat generated by its internal electronic components becomes denser during operation, so it is necessary to dissipate heat from the internal electronic components. At present, heat pipes and heat sinks are usually used to dissipate heat from electronic components, which often cannot meet the high-density heat conduction requirements, and the heat dissipation effect is not ideal. [0003] For example: Chinese Patent Publication No. CN 105377004 B, the title of the invention is a heat sink, which includes a heat sink body and a plurality of heat conduction fins. The front of the main body is integrally formed with the heat sink body. There are grooves between the bottom ends of a plurality of adjacent fins in the longitudinal direction, grooves are arranged between ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K7/20
CPCH05K7/20272H05K7/20336
Inventor 李居强
Owner 李居强
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