Control method and control system for chip welding
A technology of chip welding and control method, applied in semiconductor/solid-state device manufacturing, electrical components, electrical solid-state devices, etc., can solve the problem of high chip manufacturing cost
Active Publication Date: 2020-05-19
SHENZHEN PHOGRAIN INTELLIGENT SENSING TECH CO LTD
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Problems solved by technology
[0002] Due to the high manufacturing cost of the chip, in the process of welding the chip and other devices, the suction nozzle is used to absorb the chip and press it on the solder on the soldering seat. The gap and tightness between the chip and the solder determine the chip welding. The degree of excellence, the existing technology is to directly press the chip on the solder without considering the gap between the chip and the solder. When the gap is too small, it is impossible to avoid damage to the chip due to excessive pressure of the suction head; when the gap is too large, it cannot be avoided. Insufficient pressure leads to poor tightness between chip and solder
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[0046] In order to make the purposes, technical solutions and advantages of the embodiments of the present application clearer, the technical solutions in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments It is a part of the embodiments of this application, but not all of them. All other embodiments obtained by persons of ordinary skill in the art based on the embodiments in the present application without creative efforts shall fall within the protection scope of the present application.
[0047] figure 1 It is a schematic flow chart of a control method for chip bonding in an embodiment. In an embodiment of the present invention, refer to figure 1 , a control method for chip bonding, applied to a chip bonding device, the chip bonding device includes a suction head 210, a push pump 220, a pressure sensor 230, a welding se...
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The invention relates to a control method and a control system for chip welding. The control method and the control system are applied to a chip welding device. The chip welding device comprises a suction head, a pushing pump, a pressure sensor, a welding base and a controller, and the method comprises the steps that the welding base preheats a welding object placed on the welding base; the suction head sucks a chip to be welded; the pushing pump pushes the suction head adsorbed with the chip to get close to the welding object; the pressure sensor detects the pressure value of the chip pressedon the welding object; and the controller adjusts the pressure of the pushing pump for pushing the suction head in real time according to the pressure value. According to the method, the pushing pressure of the pushing pump on the suction head can be adjusted in real time, so that the situation that in the welding process, the chip is damaged due to too large pressure, the welding compactness isinsufficient due to too small pressure, and the yield of welding products is affected is avoided.
Description
technical field [0001] The present application relates to the technical field of semiconductors, and in particular to a control method and a control system for chip bonding. Background technique [0002] Due to the high manufacturing cost of the chip, in the process of welding the chip and other devices, the suction nozzle is used to absorb the chip and press it on the solder on the soldering seat. The gap and tightness between the chip and the solder determine the chip welding. The degree of excellence, the existing technology is to directly press the chip on the solder without considering the gap between the chip and the solder. When the gap is too small, it is impossible to avoid damage to the chip due to excessive pressure of the suction head; when the gap is too large, it cannot be avoided. Insufficient pressure results in poor die-to-solder tightness. Contents of the invention [0003] In order to solve the above technical problems, the present application provides ...
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IPC IPC(8): H01L21/603H01L21/683H01L21/67
CPCH01L24/80H01L21/67253H01L21/6838H01L2224/80
Inventor 徐虎胡美韶白文陈方均许明生
Owner SHENZHEN PHOGRAIN INTELLIGENT SENSING TECH CO LTD