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Heater package

A heater and packaging technology, applied in the direction of electric heating devices, transparent/reflective heating devices, ohmic resistance heating, etc., can solve the problems of improving the reliability of the heater package and its life, damage, etc., so that it is not easy to warp, good The effect of barrier properties

Active Publication Date: 2020-05-26
IND TECH RES INST
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the electrodes and / or the heating layer in the heater are easily damaged by the influence of water and oxygen. How to improve the barrier effect of the heater to water and oxygen through packaging technology, and thus adjust the stress to balance the stress of the heater package is not easy warping, which in turn improves the reliability and life of the heater package is critical

Method used

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Embodiment Construction

[0036] The directional terms mentioned in the embodiments, such as "up", "down", "front", "rear", "left", "right", etc., are only referring to the directions of the drawings. Accordingly, the directional terms used are illustrative, not limiting, of the invention. In the figures, each figure illustrates the general features of methods, structures and / or materials used in certain exemplary embodiments. However, these drawings should not be interpreted as defining or limiting the scope or nature encompassed by these exemplary embodiments. For example, the relative thicknesses and positions of layers, regions and / or structures may be reduced or exaggerated for clarity. The following description refers to the reference numerals, when the same numerals appear in different drawings, they will be regarded as the same or similar elements. These embodiments are only a part of the present invention, and do not reveal all possible implementation modes of the present invention. Rather,...

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Abstract

The invention discloses a heater package, including a substrate, a first barrier layer, at least one heater, and a second barrier layer. The first barrier layer is disposed on a surface of the substrate and has a first treatment layer on a side away from the substrate. The heater is disposed on the substrate and includes a heating layer and at least one electrode. The at least one electrode and the heating layer contact with each other. The second barrier layer covers an upper surface and a sidewall of the heater and has a second treatment layer on an opposite side or the side away from the substrate. A ratio of a thickness of the first treatment layer to a thickness of the first barrier layer and a ratio of a thickness of the second treatment layer to a thickness of the second barrier layer range from 0.03 to 0.2.

Description

technical field [0001] The present invention relates to a heater package. Background technique [0002] Electric heating technology has the advantages of high heat conversion efficiency and convenient pavement design, and has been widely used in modern construction engineering, home appliances, decoration and other fields. In recent years, due to the rise of automotive and smart wearable devices, research on flexible heaters has gradually attracted attention. However, the electrodes and / or the heating layer in the heater are easily damaged by the influence of water and oxygen. How to improve the barrier effect of the heater to water and oxygen through packaging technology, and thus adjust the stress to balance the stress of the heater package is not easy Warping, thereby improving the reliability and life of the heater package, is critical. Contents of the invention [0003] An embodiment of the invention provides a heater package, which can have good barrier property an...

Claims

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Application Information

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IPC IPC(8): H05B3/04
CPCH05B3/04H05B3/84H05B3/36H05B3/141H05B3/145H05B3/12H05B2214/04H05B3/03H05B2203/017H05B3/146
Inventor 郭燕静洪健彰戴宏明廖贞慧陈鸿毅叶树棠
Owner IND TECH RES INST
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