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Layout structure of efuse

A technology of layout structure and fuse, which is applied in the direction of electrical components, electric solid devices, circuits, etc., can solve the problem that the pad part occupies a large area, and achieve the effect of reducing the layout area, good heat dissipation effect, and reducing the area

Pending Publication Date: 2020-06-02
SHANGHAI HUALI MICROELECTRONICS CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Fuses for conventional efuse units such as figure 1 and figure 2 As shown, they are wine glass type and I-shaped in turn. The characteristic is that the whole fuse is composed of two parts, the Pad part and the fuse body (link). Both of them are arranged in the same metal layer plane, considering the current capacity and heat dissipation characteristics, the Pad part often occupies a larger area

Method used

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  • Layout structure of efuse
  • Layout structure of efuse
  • Layout structure of efuse

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Embodiment Construction

[0030] Embodiments of the present invention are described below through specific examples, and those skilled in the art can easily understand other advantages and effects of the present invention from the content disclosed in this specification. The present invention can also be implemented or applied through other different specific implementation modes, and various modifications or changes can be made to the details in this specification based on different viewpoints and applications without departing from the spirit of the present invention.

[0031] see Figure 3 to Figure 10 . It should be noted that the diagrams provided in this embodiment are only schematically illustrating the basic idea of ​​the present invention, and only the components related to the present invention are shown in the diagrams rather than the number, shape and shape of the components in actual implementation. Dimensional drawing, the type, quantity and proportion of each component can be changed ar...

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Abstract

The invention provides a layout structure of an efuse, which at least comprises a plurality of metal layers stacked from bottom to top, wherein a single through hole is formed between every two metallayers; the projections of the through holes are completely overlapped in the vertical direction, the through holes and the metal layers form a series structure, and the series structure forms a fusebody; the uppermost metal layer is provided with a bonding pad connected with the uppermost through hole; and the lowermost metal layer is provided with a bonding pad connected with the lowermost through hole. According to the layout structure of the efuse, the single through holes between the plurality of metal layers are connected in series to form the fuse body, and bonding pads are arranged atthe two ends of the fuse body to form an effective heat dissipation area, the layout area of the efuse on the plane can be reduced according to the structure, a good heat dissipation effect can be obtained, it is ensured that the fuse structure of each efuse unit can be reduced by about 30% by adopting the layout provided by the invention when fusing occurs on the fuse body.

Description

technical field [0001] The invention relates to the technical field of semiconductors, in particular to a layout structure of an efuse fuse. Background technique [0002] eFuse (fuse) is based on the principle of electromigration (EM), and realizes a highly reliable on-chip programming function by blowing the fuse. As the requirements for the chip area are getting higher and higher, the efuse module is used as a dedicated IP for parameter setting inside the chip, and the area parameter is one of its main design indicators. Inside the efuse module, the array composed of efuse basic units occupies more than half of the entire IP area. [0003] Conventional efuse fuses are in the shape of a wine glass and an I-shape. The entire fuse is composed of two parts: the Pad part and the fuse body (link). Both are arranged on the same metal layer plane, considering the current capacity and heat dissipation. Features, the Pad (pad) part often occupies a larger area. Fuses for conventi...

Claims

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Application Information

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IPC IPC(8): H01L23/525H01L23/367H01L27/02
CPCH01L23/5256H01L23/3677H01L27/0207
Inventor 晏颖金建明
Owner SHANGHAI HUALI MICROELECTRONICS CORP