A method for installing and dismounting a coating substrate
A substrate and installed technology, which is applied in the field of vacuum film preparation, can solve the problems of increasing the difficulty of removing the substrate, removing the substrate, and large deformation, so as to enrich the functions of the substrate, ensure the quality of the substrate, and automate high degree of effect
Active Publication Date: 2022-06-07
OPTORUN SHANGHAI CO LTD
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Problems solved by technology
The thickness of the substrate is generally between 0.2-1mm. It is fragile and has a large amount of deformation. It is difficult to remove the substrate stably and safely by the general peeling method, and it is easy to damage the substrate during the peeling process.
In addition, when some film systems are coated, the front of the substrate is not allowed to contact the task object, which increases the difficulty of removing the substrate.
Method used
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Embodiment
[0030] Example: such as figure 2 As shown, the method of installing and dismounting the coated substrate in this embodiment is used for installing, fixing and dismounting between the substrate 5 and the substrate 6 . When this method is applied to the coating process, the substrate 6 to be coated needs to be installed and fixed on the substrate 5 to be coated in a vacuum coating chamber under the support of the substrate 5, and the coated substrate needs to be disassembled from the substrate 5 for subsequent operations.
[0031] The method of the present embodiment comprises the following steps:
[0032] 1) On the substrate 5, a sticking surface with ups and downs is set. The sticking surface is used to bond and fix the substrate 6 to be coated so that the substrate 6 to be coated is mounted and fixed on the substrate 5, and the sticking surface is on the substrate. 6, there are areas with relatively small cohesive force and relatively large cohesive force within the range ...
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Abstract
The invention relates to the technical field of vacuum thin film preparation, in particular to a method for installing and dismounting a coating substrate. On the substrate, a sticking surface with ups and downs is provided, and the sticking surface is used to bond and fix the substrate so that the substrate can be installed and fixed. to the substrate, and the bonding surface forms an area with relatively small adhesive force and an area with relatively large adhesive force within the range of the substrate; from the adhesive area with relatively small adhesive force to the bonded area The bonding area with relatively large force overcomes the bonding force between the substrate and the bonding surface to gradually peel off the substrate to realize the disassembly and separation of the substrate and the substrate. The advantages of the present invention are: it can provide sufficient adhesive force required for substrate installation and fixation to meet its installation requirements, and the provided adhesive force can be adjusted for different substrates, with high flexibility, strong versatility, and adaptable surface wide; Realize the safe and efficient removal of the substrate, ensure the safety of the substrate during the removal operation, avoid damage to the substrate, and effectively guarantee the quality of the substrate.
Description
technical field [0001] The invention relates to the technical field of vacuum thin film preparation, in particular to a method for installing and disassembling a coating substrate. Background technique [0002] At present, the coating equipment requires that the substrate to be filmed be fixed on the substrate disk through the adhesive tape on the substrate disk, and then sent into the coating equipment. When forming a film, the substrate is in a high vacuum environment, the temperature is about 200°C, and the substrate is in a vertical state for circular motion. Therefore, there must be considerable adhesion between the tape and the substrate. After the film is formed, the substrate is sent out from the coating equipment. At this time, the substrate needs to be peeled off from the adhesive tape on the substrate disk. The thickness of the substrate is generally between 0.2-1mm. It is fragile and has a large amount of deformation. It is difficult to remove the substrate sta...
Claims
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IPC IPC(8): C23C14/56C23C16/54
CPCC23C14/56C23C16/54Y02P70/50
Inventor 陈韶华余海春张洪
Owner OPTORUN SHANGHAI CO LTD