Flip film LED chip structure and preparation method thereof
A LED chip, flip-chip technology, used in electrical components, circuits, semiconductor devices, etc.
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[0062] Based on this, the present invention provides a method for preparing a flip-chip thin-film LED chip structure, comprising:
[0063] A wafer-level flip-chip LED chip structure is provided. The wafer-level flip-chip LED chip structure includes a growth substrate, an epitaxial structure located on the growth substrate, located on the same side as the epitaxial structure, and connected to the epitaxial structure. a first electrode and a second electrode electrically connected respectively, and a first insulating layer located outside the first electrode and the second electrode;
[0064] Provide a conductive substrate, the conductive substrate includes a conductive substrate, the conductive substrate includes a first surface and a second surface oppositely arranged; a first electrode layer located on the first surface of the conductive substrate; a first electrode layer located on the second surface of the conductive substrate The first conductive layer and the second condu...
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