Cutting method for reducing cutting loss of LED chip

Abstract

The invention discloses a cutting method for reducing the cutting loss of an LED chip. The method comprises steps of firstly carrying out the half-cutting of a P surface of the chip, carrying out thetesting through a testing machine, and facilitating the output of photoelectric parameters, such as brightness, voltage and wavelength, of the chip; coating photoresist on the P surface of the chip byusing a spin coater to form a shielding film, exposing and developing the P surface of the chip, and corroding and exposing a cutting channel; coating photoresist on the N surface of the chip to protect the metal on the N surface and facilitate subsequent dry etching; washing off the shielding film on the P surface, pasting a blue film, finally washing off the adhesive film on the N surface, pouring the film, and finishing the cutting operation. According to the cutting method for reducing the cutting loss of the LED chip, the N-surface adhesive film design is utilized, and dry etching is matched, so situations of edge breakage, wafer flying and the like during chip cutting are effectively avoided, cutting loss of the chip is reduced, meanwhile, light emitting efficiency of tube core particles is guaranteed, the product yield is increased, and practicability is high.

Description

technical field [0001] The invention relates to the technical field of LED manufacturing, in particular to a cutting method for reducing cutting loss of LED chips. Background technique [0002] Due to its high luminous efficiency, wide color range, and long service life, LED chips have been widely valued in the semiconductor lighting industry, and have been widely used in various fields such as display screens, traffic lights, landscape lighting, and automotive status displays. Especially in recent years, with the development of technology and breakthroughs, the small-pitch screens used for mobile phones, outdoor displays, etc. However, the requirements for products are getting smaller and smaller, and the LED core is facing higher requirements. While the size of the core is reduced to further increase the output, the luminous brightness of the core must also maintain a high test result. The manufacturing process of the die puts forward more stringent requirements. [0003...

AI Technical Summary

Problems solved by technology

This method of operation is a typical mechanical cutting. The disadvantage is that the full-thickness cutting along the half-cut cutting path, the height of the knife must be reduced and the depth of the knife should be deepened, and the contact area between the back of the knife and the surface of the chip will increase. The region's losses are also the largest

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