Rotary etching device and rotary etching method for high-precision ultrathin glass

Abstract

The invention discloses a rotary etching device and rotary etching method for high-precision ultrathin glass, wherein the device comprises clamps used for loading glass substrates, a basket used for fixing a plurality of clamps loaded with the glass substrates, a CST tray is used for mounting a basket, can greatly move and slightly swing and can control the basket to rotate, and an etching equipment provided with an etching area capable of spraying an etching liquid on the top or two sides of the CST tray and a cleaning area capable of spraying cleaning liquid on the top or two sides of the CST tray. According to the method, the rotary etching device for the high-precision ultra-thin glass is adopted for etching the high-precision ultra-thin glass, the thickness of the high-precision ultra-thin glass is 0.03-0.1 mm, and the thickness deviation is + / -5% of the thickness of the glass. According to the rotary etching device and the rotary etching method, the etching conditions of all surfaces of the glass substrates can be ensured to be the same, the thickness precision is improved, and the surface quality is improved.

Description

technical field [0001] The invention relates to the technical field of ultra-thin glass preparation, more specifically, to a rotary etching device and a rotary etching method for high-precision ultra-thin glass. Background technique [0002] The cover glass of foldable mobile phones needs to use ultra-thin Ultra thin Glass (abbreviated as UTG, which solves the problems of the current cover material CPI). Ultra thin Glass products require precise glass thickness and surface quality. At present, 0.07mm glass can be purchased on the market, but the price is very expensive, and glass thinner than it is not sold. [0003] Therefore, in practice, the thick glass of 0.2-0.4 mm is thinned to an ultra-thin glass of 0.03-0.07 mm for use. The original process used to manufacture thin glass is to first fix the glass substrate on the basket, and then move the basket only to the left and right in the direction of etching for etching. At this time, due to the thickness of the glass subst...

AI Technical Summary

Problems solved by technology

At this time, due to the thickness of the glass substrate, when the amount of glass etching increases, the etching conditions in each area are different due to the solution flowing from top to bottom and the injection pressure deviation of the etching solution, which eventually leads to increased thickness deviation and poor surface quality. and other shortcomings

Images