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Heat-conducting device and processing method thereof

A processing method and heat technology, applied in the processing of the above-mentioned heat conduction device, and in the field of heat conduction devices, can solve the problems of unsatisfactory heat conduction effect of the heat conduction device, improvement, and influence on the heat dissipation performance of electronic equipment, etc., to achieve maximum heat storage, good fluidity, The effect of increasing the maximum heat storage

Pending Publication Date: 2020-06-16
LENOVO (BEIJING) LTD
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] At present, electronic equipment such as notebook computers often use heat conduction devices to transfer the heat generated inside the electronic equipment to the outside of the electronic equipment for more timely and sufficient heat dissipation. However, the heat conduction effect of the existing heat conduction devices is not ideal, which affects Improvement of thermal performance of electronic equipment

Method used

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  • Heat-conducting device and processing method thereof
  • Heat-conducting device and processing method thereof
  • Heat-conducting device and processing method thereof

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Embodiment Construction

[0040] The present application provides a heat conduction device, the heat conduction effect of which is significantly improved.

[0041] The following will clearly and completely describe the technical solutions in the embodiments of the application with reference to the drawings in the embodiments of the application. Apparently, the described embodiments are only some of the embodiments of the application, not all of them. Based on the embodiments in this application, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the scope of protection of this application.

[0042] Such as Figure 1-Figure 4 As shown, the embodiment of the present application provides a heat conduction device, which can be installed in an electronic device such as a notebook computer, so as to conduct heat inside the electronic device to the outside of the electronic device. The heat conduction device mainly includes a main body part 1, here...

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Abstract

The invention discloses a heat conduction device and a processing method thereof, and the heat conduction device comprises a main body part which is provided with an inner cavity capable of being closed, and the inner cavity can accommodate a medium and allows the medium to carry heat to flow in the inner cavity; wherein the surface of the inner cavity is a concave-convex surface with a height difference, a plurality of parts of the concave-convex surface have the height difference, and the part with the height difference is provided with a micro-channel for guiding the medium. According to the heat conduction device with the structure, the maximum heat storage amount can be increased while the medium has good fluidity, so that the heat conduction device has the advantages of multiple aspects, and the heat conduction effect of the heat conduction device is remarkably improved.

Description

technical field [0001] The present application relates to the technical field of electronic equipment, in particular to a heat conduction device, and also relates to a processing method of the heat conduction device. Background technique [0002] At present, electronic equipment such as notebook computers often use heat conduction devices to transfer the heat generated inside the electronic equipment to the outside of the electronic equipment for more timely and sufficient heat dissipation. However, the heat conduction effect of the existing heat conduction devices is not ideal, which affects Improvement of thermal performance of electronic equipment. Contents of the invention [0003] In view of this, the present application provides a heat conduction device, the heat conduction effect of which is significantly improved. [0004] In order to achieve the above object, the application provides the following technical solutions: [0005] A heat conduction device, comprisin...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G06F1/20B23P15/26B23P15/00B22F7/08
CPCG06F1/203B23P15/26B23P15/00B22F7/08B23P2700/10F28F2255/18F28F1/40F28F1/02F28D2021/0029F28D15/046F28F2260/02
Inventor 焦均郭联明董华君
Owner LENOVO (BEIJING) LTD
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