Unlock instant, AI-driven research and patent intelligence for your innovation.

A mechanical arm device and method for reducing its shaking and vibration

A robotic arm, sliding seat technology, applied in the directions of manipulators, program-controlled manipulators, conveyor objects, etc., can solve problems such as wafer damage, and achieve the effect of improving stability, subtle changes, and improving stability

Active Publication Date: 2022-03-18
ULTRON SEMICON (SHANGHAI) CO LTD +1
View PDF7 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] In view of the deficiencies in the prior art, the purpose of the present invention is to provide a mechanical arm device and a method for reducing its shaking and vibration, which can effectively reduce the vibration when moving the basket, so as to solve the existing problem of reducing the mechanical arm's movement of wafers. There is a problem of wafer damage due to vibration when supporting the basket

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • A mechanical arm device and method for reducing its shaking and vibration
  • A mechanical arm device and method for reducing its shaking and vibration
  • A mechanical arm device and method for reducing its shaking and vibration

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0034] In order to make the technical means, creative features, goals and effects achieved by the present invention easy to understand, the present invention will be further described below in conjunction with specific embodiments.

[0035] see figure 1 and Figure 6 , figure 1 It is a structural schematic diagram of the mechanical arm device of the present invention; Figure 6 It is a structural schematic diagram of the present invention when clamping a wafer and a supporting basket.

[0036] A mechanical arm device for clamping and moving a wafer support basket, comprising a clamping mechanism 1 for clamping a wafer 6 and a support basket 7, a driving mechanism 2 for driving the clamping mechanism 1 for clamping operation, The lifting mechanism 3 fixed on the bottom of the driving mechanism 2 for lifting and driving and the lateral moving mechanism 4 fixed on one side of the lifting mechanism 3 for driving lateral movement. When clamping and moving, the lateral position i...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention provides a mechanical arm device and a method for reducing its shaking and vibration. The clamping and moving device includes a clamping mechanism for clamping a wafer support basket, a driving mechanism for driving the clamping mechanism to perform clamping operation, a fixed The bottom of the driving mechanism is used for the lifting mechanism for lifting and driving, and the lateral moving mechanism is fixed on one side of the lifting mechanism for driving lateral movement. The invention can effectively reduce the vibration when the basket is moved, so as to solve the existing problem of reducing the damage of the wafer caused by the vibration of the mechanical arm when the basket is moved.

Description

technical field [0001] The invention relates to the technical field of wafer processing, in particular to a mechanical arm device and a method for reducing its shaking and vibration. Background technique [0002] In semiconductor wet process equipment, it is basically composed of wafer loading / unloading, cleaning process section, drying process section, pipeline circuit configuration area, and wafer transfer robot arm module. The round loading / unloading shuttles with each process section to realize loading and unloading of wafers or batches of wafers to designated sections. The robotic arm device module is usually installed on the skeleton and frame of the wet equipment, and is installed through a specific installation mode. However, the long-term high-frequency use cycle of the robotic arm may encounter various motion behaviors such as shaking and vibration. The stress concentration, offset, and deflection of various causes of misalignment in different directions require a...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/677H01L21/67H01L21/687B25J9/00B25J9/10B25J9/12B25J15/02B25J15/08B25J19/02
CPCH01L21/67706H01L21/67766H01L21/68742H01L21/68721H01L21/67253B25J9/0009B25J9/123B25J9/1035B25J15/02B25J15/08B25J19/02
Inventor 邓信甫李志峰庄海云徐铭陈佳炜
Owner ULTRON SEMICON (SHANGHAI) CO LTD