High multi-layer board layer detection fool-proof method

Abstract

The invention discloses a high multi-layer board layer detection fool-proof method, which comprises the following steps: sequentially stacking and pressing a plurality of inner-layer core boards, anda detection module being arranged on the process edge of the same side of each inner-layer core board and is close to the edge position; and checking the stacking sequence of the inner-layer core plates subjected to press-fit forming from the side surface, if the arrangement of the detection modules is distributed in a preset shape, determining that the stacking sequence is correct, and if the arrangement of the detection modules is not distributed in the preset shape, determining that the stacking sequence is wrong. The invention provides a high multilayer board layer detection fool-proof method. Throught designing the detection module on the process edge of each inner-layer core plate to distinguish whether the inner-layer core plates are misplaced or not for identification and detection, a fool-proof effect is achieved, abnormal leakage can be reduced, outflow of bad products is avoided, and the detection device is quite worthy of adoption and popularization for factories for producing high multilayer circuit boards in batches at present.

Description

technical field [0001] The invention relates to the technical field of printed circuit boards, in particular to a layer-specific detection and anti-fooling method for high-multilayer boards. Background technique [0002] With the development of printed circuit boards towards high-density refinement, inter-layer wiring and component placement are becoming more and more dense, the design of high-layer boards has become normal, and multiple identical core boards in the stacking structure of high-layer PCBs It has become a common phenomenon to laminate core boards with different thicknesses or different copper thicknesses, but it is difficult to distinguish and identify them only by naked eyes, resulting in the unavoidable over-placement, under-placement, and misplacement during the production pre-stacking process The phenomenon of the core board. Even after pre-stacking, manual selection by X-Ray is extremely error-prone, because each layer can be illuminated, so the misplaced...

AI Technical Summary

Problems solved by technology

[0002] With the development of printed circuit boards towards high-density refinement, inter-layer wiring and component placement are becoming more and more dense, the design of high-layer boards has become normal, and multiple identical core boards in the stacking structure of high-layer PCBs It has become a common phenomenon to laminate core boards of different thicknesses or different copper thicknesses, but it is difficult to distinguish and identify them with the naked eye, resulting in the unavoidable over-placement, under-placement, and misplacement during the pre-stacking process. The phenomenon of core board

Even after pre-stacking, it is very easy to make mistakes by artificially selecting according to X-Ray, because each layer can be illuminated, so the misplaced layers between adjacent layers cannot be identified

In the actual production process, once there is an error in the wrong layer, and if the leakage cannot be detected in the electrical measurement functional test, the client will face a high claim, which will seriously affect the company's reputation

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