Welding process and acoustic components

Abstract

The invention discloses a welding process and an acoustic component. The welding process comprises the following steps: providing a circuit board and an acoustic component; preparing a tin ring; pre-assembling the circuit board and the acoustic component to form a pre-assembled structure, the The pre-assembled structure has a position to be welded; feeding the tin ring to the position to be welded; performing welding to obtain an acoustic component. The invention aims to provide a welding process suitable for welding and assembling of small-structure products, which not only ensures the amount of tin welded for small products, improves the welding yield, but also reduces the welding time.

Description

technical field [0001] The invention relates to the technical field of acoustic component welding, in particular to a welding process and an acoustic component prepared by applying the welding process. Background technique [0002] In the production of headphones, as the function of the product increases, the structural design becomes more and more complicated. In order to ensure the achievable assembly of the product, the assembly of many acoustic components (MIC / SPK) is arranged in the middle and later stages, and then combined with the circuit board (PCB). / FPC) for soldering continuity. [0003] The existing welding method usually adopts the solder wire welding method, that is, the soldering iron tip is placed at a certain angle and is placed on the PIN pin and the pad of the acoustic element, and the PIN pin and the pad are heated by the soldering iron tip; at the same time, the solder wire is fed from one side. The solder wire is melted under the heat conduction of th...

AI Technical Summary

Problems solved by technology

However, this soldering method is applied to small-structure products. On the one hand, the amount of tin cannot be guaranteed, so that the height of the tin spot after soldering of the product often exceeds the height of the PIN pin, resulting in that the product cannot meet the assembly requirements in a very small assembly space; on the other hand On the one hand, limited by the small structure of the product and the control height of the amount of tin, it is impossible to realize one-time soldering, resulting in too long soldering time, which ultimately makes it difficult to guarantee the soldering yield

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