Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Semiconductor chip character surface defect pin defect detection light source

A defect detection, semiconductor technology, used in optical testing flaws/defects, measuring devices, material analysis by optical means, etc., can solve problems such as not being able to achieve results at the same time

Active Publication Date: 2020-07-03
HEFEI TUXUN ELECTRONICS TECH
View PDF11 Cites 2 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, a single light source can only cooperate with the camera to detect one station. Three identical light sources are placed on the same track to detect the surface, pins, and copper leaks respectively. In the case of compatibility with different products, all ideal effects cannot be achieved at the same time.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Semiconductor chip character surface defect pin defect detection light source
  • Semiconductor chip character surface defect pin defect detection light source
  • Semiconductor chip character surface defect pin defect detection light source

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0036] In order to make the purpose, technical solutions and advantages of the embodiments of the present invention more clear, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments It is a part of embodiments of the present invention, but not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

[0037] The invention provides a semiconductor chip character surface defect pin defect detection light source, which uses a combination of a square light source and a ring light source to detect the semiconductor chip. The square light source can distinguish the copper leakage phenomenon of the product, and is used for detectin...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention provides a semiconductor chip character surface defect pin defect detection light source which comprises a first optical assembly, a second optical assembly and a light scattering plate.A light scattering plate is installed at the rear end of the first optical assembly, and the front end is connected with the second optical assembly. The first optical assembly comprises a square light source shell and a patch LED lamp, and the patch LED lamp is installed on the inner side of the square light source shell. The second optical assembly comprises a first double-row LED light sourcecover, a first double-row LED light source, a polarizing film, a double-row LED light source cover polarizing clamping ring, a second double-row LED light source cover, an adapter and a second double-row LED light source. The adapter, the second double-row LED light source cover and the first double-row LED light source cover are connected in sequence. The second double-row LED light source is embedded in the adapter. The first double-row LED light source, the polarizing film and the double-row LED light source cover polarizing clamping ring are installed in the first double-row LED light source cover. The light source solves the problem that three light sources of an old version are overlapped on the same track, achieves an ideal effect under the condition of being compatible with other various detection products, and meets the detection standard.

Description

technical field [0001] The invention belongs to the field of combined light sources for detection, in particular to a light source for detecting surface defects of semiconductor chips and pins. Background technique [0002] The appearance inspection requirement of frame products is the surface quality inspection of the plastic package. Whether there are surface quality defects such as damage, scratches, and pores on the surface of the plastic package. Using machine vision inspection system is the most effective and fastest inspection method. Cameras, lenses, and light sources are the main components. The light source is used to irradiate the surface of the frame product, so that the part of the plastic package has a similar gray scale, so that the black and white parts on the plastic package are extracted by software, and the defects of the plastic package are detected. The traditional inspection device consists of an area array camera, an industrial zoom lens, and a squa...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): G01N21/95G01N21/01
CPCG01N21/8806G01N21/95G01N21/01G01N2201/061G01N2201/062G01N2201/063
Inventor 张祥明
Owner HEFEI TUXUN ELECTRONICS TECH
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products