Product label error prevention device of wafer cutting machine

A wafer slicing machine and slicing machine technology, applied in electrical components, semiconductor/solid-state device manufacturing, circuits, etc., can solve problems such as abnormal product quality, label peeling, abnormal product mixing, etc.

Pending Publication Date: 2020-07-07
HITECH SEMICON WUXI
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0002] When the existing wafer splitting machine is working, it will often cause the label to fall off, and the fallen label is often pasted on other products
Since there is no relevant alarm mechanism for the equipment, it often leads to the post-engineering identification of the wrong product label, which leads to abnormal product mixing and abnormal product quality in large quantities.

Method used

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  • Product label error prevention device of wafer cutting machine
  • Product label error prevention device of wafer cutting machine

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Embodiment Construction

[0015] Depend on figure 1 As can be seen, this patent includes a product label, the product label is placed on the exposed adhesive layer next to the wafer, under the non-stick laminate, the bottom of the adhesive layer is the base film, and the non-stick laminate is made of iron fluorine dragon material.

[0016] Preferably, a barcode recognizer is also included, the barcode recognizer is placed at the feed and discharge positions of the splitter, the barcode recognizer is used to scan the product label, the barcode recognizer performs data interaction with the server, and uses the product Label identification and alarm, used to record information collection and comparison of product labels entering and exiting equipment.

[0017] Before the equipment feeds, first identify the product label information of the current operating product; after the wafer splitting operation is completed, identify the product label information again when the material is discharged, and after cap...

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PUM

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Abstract

The invention discloses a product label error prevention device of a wafer cutting machine, which comprises a Teflon non-stick laminated plate, wherein the non-stick laminated plate is arranged in a slide way of a wafer. According to the invention, equipment alarm logic is changed, so that an alarm can be given at the first time when an undesirable abnormality occurs, related measures are notifiedto perform exception handling, the risk of product label marking errors is avoided, and the product quality stability is guaranteed very reliably. Meanwhile, by researching and improving the hardwarestructure of the equipment, the root cause of product label errors is improved, alarms generated after logic transformation of the equipment are further reduced, and the labor cost is not increased completely on the basis that the quality safety is guaranteed.

Description

technical field [0001] The invention relates to the field of semiconductors, in particular to a product label error prevention device for a wafer splitter. Background technique [0002] When the existing wafer splitting machine is working, it often causes the label to fall off, and the label that falls off is often pasted on other products. Since there is no relevant alarm mechanism for the equipment, it often leads to the post-engineering to identify the wrong product label, which leads to abnormal product mixing and abnormal product quality in large quantities. [0003] CN201410851915.3 A wafer cutting device, comprising a wafer carrying platform, an L-shaped telescopic bracket, a wafer fixing frame, rollers and a cutting knife, the cutting knife is fixed on the top of the L-shaped telescopic bracket, the The wafer carrying platform is connected to the middle position of the L-shaped retractable support, and the wafer carrying platform is covered with an adhesive film, an...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/67H01L21/78
CPCH01L21/67294H01L21/78
Inventor 姜泽芳
Owner HITECH SEMICON WUXI
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