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Memory heat dissipation structure of low-load server

A heat dissipation structure and server technology, applied in the computer field, can solve the problems of inconvenient disassembly and assembly of the memory heat dissipation structure of low-load servers, and achieve the effect of avoiding the increase of heat generation, solving the inconvenient disassembly and assembly, and convenient handling

Pending Publication Date: 2020-07-10
HITECH SEMICON WUXI
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0003] A low-load server memory heat dissipation structure proposed by the present invention solves the problem of inconvenient disassembly and assembly of the existing low-load server memory heat dissipation structure

Method used

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Embodiment Construction

[0016] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention.

[0017] refer to Figure 1-2 , a low-load server memory heat dissipation structure, including a chassis 1, a server 2, two side panels 5, two installation frames 8 and two fixed frames 16, the server 2 is fixedly connected to the bottom inner wall of the chassis 1, and the two sides of the chassis 1 There are gaps on the sides, and the two side plates 5 are respectively located outside the two gaps. The exteriors of the two side plates 5 are screwed with a plurality of first bolts 7, and the two side plates 5 and the chassis 1 are connected by a first bolt 7. The bolts 7 are fixedly connected, the two installation frames 8 are located inside the cabinet 1, the two ins...

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Abstract

The invention relates to the field of computers. and discloses a memory heat dissipation structure of a low-load server. The problem that an existing low-load server memory heat dissipation structureis inconvenient to disassemble and assemble is solved. Proposed now is the following scheme, the structure comprises a case, a server, two side plates, two mounting frames and two fixing frames, the server is fixedly connected with the inner wall of the bottom of the case, notches are formed in the two sides of the case, the two side plates are located outside the two notches respectively, a plurality of first bolts is connected to the outer portions of the two side plates in a threaded mode, the two side plates are fixedly connected with the case through the first bolts, and the two mountingframes are located in the case. The structure is reasonable in structure, ingenious in design and easy to operate, the problem that an existing low-load server memory heat dissipation structure is inconvenient to disassemble and assemble is solved, the heat dissipation effect is good, dust on the fan blades and the filter screen can be conveniently removed, and the situation that the heat productivity of a server is increased due to the influence of the dust is avoided.

Description

technical field [0001] The invention relates to the field of computers, in particular to a low-load server memory cooling structure. Background technique [0002] A server is an important accessory of a computer and a device that provides computing services. The server needs to respond to service requests and process them. When the server is working, high temperature will be generated inside the server chassis. Some low-load servers have appeared in the prior art, and heat generation is reduced by reducing the load of the servers, but the low-load servers still generate more heat during operation. However, the traditional server heat dissipation structure uses fans for heat dissipation, and the purpose of heat dissipation is achieved by exchanging the air inside the chassis with the outside air. During the process of heat exchange, dust and floating objects in the outside air will enter the inside of the chassis. If these dusts and floating objects are not cleaned up in ti...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G06F1/18G06F1/20
CPCG06F1/182G06F1/20
Inventor 赵腾俊
Owner HITECH SEMICON WUXI
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