Double-sided heat dissipation power module

Abstract

The embodiment of the invention provides a double-sided heat dissipation power module. The module comprises an upper bridge plate and a lower bridge plate which are arranged in a stacked mode. A firstchip is arranged on the surface of one side, facing the lower bridge plate, of the upper bridge plate; a second chip is arranged on the surface of one side, facing the upper bridge plate, of the lower bridge plate, wherein the first chip and the second chip are arranged in a staggered manner, the outer side surfaces of the first chip and the second chip are respectively provided with a first electrode pressing block and a second electrode pressing block, the upper bridge plate and the lower bridge plate are connected into a whole in a pressing manner, and the first electrode pressing block and the second electrode pressing block are respectively and correspondingly pressed against the lower bridge plate and the upper bridge plate. According to the double-sided heat dissipation power module of the invention, heat generated when the first chip and the second chip work is transmitted to the other bridge plate through the first electrode pressing block and the second electrode pressing block; double-sided heat dissipation is realized, crimping between the upper bridge plate and the lower bridge plate has certain movement allowance, material deformation stress generated by each component is remarkably buffered, circuit components are effectively protected, the working stability of the module is improved, and the service life of the module is prolonged.

Description

technical field [0001] Embodiments of the present invention relate to the technical field of semiconductor power devices, in particular to a double-sided heat dissipation power module. Background technique [0002] The power module will generate a lot of heat during the working process, which will cause damage to the internal components, and it needs to be dissipated. Traditional power modules generally dissipate heat through one side, but when the internal heat of the module is too high, the heat dissipation efficiency of one side is too low, so it is necessary to use a double-sided heat dissipation module to dissipate the heat generated by internal components. The double-sided heat dissipation module is generally composed of two upper and lower substrates with a heat dissipation structure. The components are placed on one of the substrates, and then the other substrate is placed on top of it. The internal components are installed by superimposing the two substrates. Heat ...

AI Technical Summary

Problems solved by technology

Traditional power modules generally dissipate heat through one side, but when the internal heat of the module is too high, the heat dissipation efficiency of one side is too low, so it is necessary to use a double-sided heat dissipation module to dissipate the heat generated by internal components

The double-sided heat dissipation module is generally composed of two upper and lower substrates with a heat dissipation structure. The components are placed on one of the substrates, and then the other substrate is placed on top of it. The internal components are installed by superimposing the two substrates. Heat dissipation, but in the heat dissipation process, because the components are concentrated on the same substrate, the heat source is relatively concentrated, so that the other substrate cannot dissipate the heat generated by the internal components well, and most of the two substrates are rigidly connected. It makes the components in it easy to be squeezed and damaged between the two substrates when heated and deformed, affecting the operation of the internal circuit

Images