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Semiconductor device

A semiconductor and frame technology, applied in the direction of semiconductor devices, semiconductor/solid-state device parts, electric solid-state devices, etc., can solve the problems of small cooling effect and overheating

Active Publication Date: 2020-07-14
MITSUBISHI ELECTRIC CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the cooling effect of components not mounted on the heat sink is smaller than that of power semiconductor elements mounted on the heat sink
In addition, there is a problem that these components are overheated due to the heat generated by power semiconductor elements

Method used

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  • Semiconductor device
  • Semiconductor device
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Examples

Experimental program
Comparison scheme
Effect test

Embodiment approach 1

[0032] (Structure of semiconductor device)

[0033] The semiconductor device in Embodiment 1 will be described. figure 1 It is a perspective view schematically showing the structure of the semiconductor device in the first embodiment. figure 2 is a cross-sectional view schematically showing the structure of the semiconductor device in Embodiment 1, showing figure 1 The section at A-A' is shown. image 3 It is a perspective view schematically showing the structure of the heat sink 5 included in the semiconductor device in the first embodiment. In Embodiment 1, with respect to the mounting direction of the semiconductor device, one end 3 a of the heat sink 5 is on the lower side, and the other end 3 b is on the upper side.

[0034] Semiconductor devices such as figure 2 The heat sink 5 on which the semiconductor module 2 is mounted, the frame 6 , the fan 7 , the first vent 8 and the second vent 9 are shown. The semiconductor device in Embodiment 1 includes a circuit board...

Embodiment approach 2

[0082] The semiconductor device in Embodiment 2 will be described. Note that descriptions of the same configuration and operations as those in Embodiment 1 are omitted.

[0083] Figure 12 as well as Figure 13 All are perspective views schematically showing the structure of the semiconductor device in Embodiment 2. FIG. but, Figure 13 shows from and Figure 12 A semiconductor device viewed from the opposite side. Figure 14 is a cross-sectional view schematically showing the structure of the semiconductor device in Embodiment 2, showing Figure 12 as well as Figure 13 The section at C-C' is shown. Figure 15 It is a perspective view schematically showing the structure of the heat sink 5 included in the semiconductor device in the second embodiment. Such as Figure 14 As shown, the circuit board 1 in Embodiment 2 is mounted on a figure 2The mounting position of the circuit board 1 of the semiconductor device in the illustrated first embodiment is rotated by 90 deg...

Embodiment approach 3

[0100] A semiconductor device in Embodiment 3 will be described. Figure 16 It is a cross-sectional view schematically showing the structure of the semiconductor device in the third embodiment. Regarding the semiconductor device in the third embodiment, the configuration of the fan 7 is different from that in the second embodiment. Description of the same configuration and operation as in Embodiment 2 will be omitted. In Embodiment 3, regarding the mounting direction of the semiconductor device, Figure 16 The inside of the accompanying drawing is the lower side, and the front of the accompanying drawing is the upper side.

[0101] The fan 7 blows not only the first cooling air to the first air passage WP1 but also the second cooling air to the first vent 8 . In Embodiment 3, the fan 7 is provided on the side of the one end 3 a of the fin 3 . Moreover, the upper end part 7a of the fan 7 is located in the position higher than the bottom surface 4e of the step part 4d. That...

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PUM

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Abstract

The purpose of the present invention is to provide a semiconductor device which cools an electronic component and a semiconductor module inside a housing. The semiconductor device is equipped with: aheat sink which includes a fin and a plate-shaped base part, has a semiconductor module provided on one surface of the base part, and has the fin provided on the other surface thereof; a housing whichcovers the one surface of the base part, the semiconductor module, an electronic component, and a circuit substrate, is attached to the base part, and houses the semiconductor module between the housing and the one surface of the base part; a fan for cooling the fin; and a first ventilation port and a second ventilation port which both connect the interior and exterior of the housing. The first ventilation port is provided above the height which is half the tallest height from the circuit substrate of the electronic component mounted to one surface of the circuit substrate inside the housing.The second ventilation port penetrates from the one surface to the other surface of the base part inside the housing. The first ventilation port and the second ventilation port form a ventilation channel inside the housing. The wind speed of the cooling wind on the one surface of the circuit substrate is slower than the wind speed of the cooling wind on the electronic component.

Description

technical field [0001] The present invention relates to a semiconductor device, and in particular to a cooling technique for a heat-generating component covered by a frame. Background technique [0002] The heat dissipation of the power semiconductor device, which is a heat-generating component, is designed using a heat sink, a fan, and the like. For example, a power semiconductor device has a structure in which a heat sink including a base and fins is screwed to one surface of a power semiconductor element. Heat generated by the power semiconductor elements is radiated by ventilating cooling air generated by a fan or the like to the fins of the heat sink. However, the cooling effect of components not mounted on the heat sink is smaller than the cooling effect of the power semiconductor element mounted on the heat sink. In addition, there is a problem that these components are overheated due to the heat generated by the power semiconductor element. [0003] Patent Documen...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L23/467H01L25/07H01L25/18H05K7/20
CPCH01L23/467H01L25/07H01L25/18H01L23/367H05K7/20163H05K7/20918
Inventor 佐藤正基白形雄二铃木规央村田信二
Owner MITSUBISHI ELECTRIC CORP