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Packaging structure and packaging method of sensor

A packaging structure and packaging method technology, applied in the direction of microstructure devices, manufacturing microstructure devices, microelectronic microstructure devices, etc., can solve the problems that MEMS chips are greatly affected by stress, and achieve the effect of improving sensitivity and pressure resistance

Active Publication Date: 2020-07-17
GOERTEK MICROELECTRONICS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The main purpose of the present invention is to provide a sensor packaging structure and packaging method, aiming to improve the problem that the MEMS chip is greatly affected by stress in the current sensor packaging structure

Method used

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  • Packaging structure and packaging method of sensor
  • Packaging structure and packaging method of sensor
  • Packaging structure and packaging method of sensor

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Embodiment Construction

[0029] The technical solutions in the embodiments of the present invention will be clearly and completely described below, obviously, the described embodiments are only some of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without creative efforts fall within the protection scope of the present invention.

[0030] In addition, the technical solutions of the various embodiments of the present invention can be combined with each other, but it must be based on the realization of those skilled in the art. When the combination of technical solutions is contradictory or cannot be realized, it should be considered as a combination of technical solutions. Does not exist, nor is it within the scope of protection required by the present invention.

[0031] The present invention proposes a sensor packaging structure, such as figure 1 As shown,...

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Abstract

The invention discloses a packaging structure and a packaging method of a sensor, the packaging structure comprises a substrate and a housing forming a packaging cavity with the substrate, an MEMS chip is suspended in the packaging cavity through a support structure, and the support structure comprises a first support structure and a second support structure; the first supporting structure is fixedly connected with the substrate in the first direction. The second supporting structure is arranged in the second direction, a gap exists between the first supporting structure and the MEMS chip in the second direction, one end of the second supporting structure is connected with the first supporting structure, and the other end of the second supporting structure is connected with the MEMS chip.The MEMS chip is only in contact with the second supporting structure, the interaction force between the MEMS chip and the substrate is avoided, the second supporting structure absorbs stress, and thesensitivity and the pressure resistance of the MEMS chip are improved.

Description

technical field [0001] The invention relates to the field of semiconductor packaging, in particular to a sensor packaging structure and packaging method. Background technique [0002] The MEMS (Micro-Electro-Mechanical System, Micro-Electro-Mechanical System) sensor produces a sensitivity change through a small deformation of the diaphragm of the MEMS chip, and the stability of the sensitivity is greatly affected by the stress. At present, the substrate of the MEMS chip is generally bonded to the substrate by using glue. Since the thermal expansion coefficient of the MEMS chip substrate is different from that of the substrate, the two will undergo different deformations when baked at high temperature. , the deformation of the two has a tendency to recover; but due to the solidification of the adhesive layer between the MEMS chip substrate and the substrate, the deformation of the chip substrate and the substrate cannot be completely restored, so the deformation trend is conv...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B81B7/02B81B7/00B81C1/00
CPCB81B7/02B81B7/0054B81B7/0058B81C1/00325B81B2201/0257Y02P70/50
Inventor 于永革
Owner GOERTEK MICROELECTRONICS CO LTD