A kind of laser processing method of through hole

A laser processing method and laser technology, which are applied in the manufacturing of electrical components, circuits, semiconductor/solid-state devices, etc., can solve problems such as unfavorable electrical conductivity and affect other structures, and achieve the effect of preventing current accumulation or disconnection and eliminating air gaps.

Active Publication Date: 2020-11-27
福唐激光(苏州)科技有限公司
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  • Application Information

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Problems solved by technology

For details, please refer to Figure 8 , there is an insulating layer 1 on the top metal layer 2, the insulating layer 1 is usually an inorganic material such as silicon oxide, silicon nitride, etc., in order to ensure a large density of conductive vias, a large aspect ratio is usually formed in the insulating layer 1 The via hole 3 is filled with the conductive material 4 in the via hole 3 to form a conductive via hole, but due to the unevenness of the bottom surface and the side wall of the deposition, there will be an air gap 5 in the middle of the conductive material 4, the air gap It is extremely detrimental to electrical conductivity and will affect other structures when grinding or covering other materials

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  • A kind of laser processing method of through hole
  • A kind of laser processing method of through hole
  • A kind of laser processing method of through hole

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[0020] In order to make the purpose, technical solutions and advantages of the embodiments of the present disclosure clearer, the technical solutions of the embodiments of the present disclosure will be clearly and completely described below in conjunction with the accompanying drawings of the embodiments of the present disclosure. Apparently, the described embodiments are some of the embodiments of the present disclosure, not all of them. Based on the described embodiments of the present disclosure, all other embodiments obtained by persons of ordinary skill in the art without creative effort fall within the protection scope of the present disclosure.

[0021] Unless otherwise defined, the technical terms or scientific terms used in the present disclosure shall have the usual meanings understood by those skilled in the art to which the present disclosure belongs. "First", "second" and similar words used in the present disclosure do not indicate any order, quantity or importan...

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Abstract

The invention provides a laser processing method of a through hole. The method comprises the following steps of forming a material with a preset height, performing laser repair on an air gap positionto change the air gap into a concave hole with a larger opening and a shallower depth, and filling the material for the second time to form a final conductive through hole. According to the invention,the air gap can be eliminated, the electrical conductivity of each position of the through hole can be ensured to be the same, and the current accumulation or open circuit is prevented.

Description

technical field [0001] The invention relates to the field of semiconductor material processing and manufacturing, in particular to a laser processing method for through holes. Background technique [0002] Conductive vias are structures that must be used in semiconductor processing, chip back-end processes, etc., and are usually formed by filling conductive substances in the via holes. For details, please refer to Figure 8 , there is an insulating layer 1 on the top metal layer 2, the insulating layer 1 is usually an inorganic material such as silicon oxide, silicon nitride, etc., in order to ensure a large density of conductive vias, a large aspect ratio is usually formed in the insulating layer 1 The via hole 3 is filled with the conductive material 4 in the via hole 3 to form a conductive via hole, but due to the unevenness of the bottom surface and the side wall of the deposition, there will be an air gap 5 in the middle of the conductive material 4, the air gap It is ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/768
CPCH01L21/76894
Inventor 陈洁
Owner 福唐激光(苏州)科技有限公司
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