A bracket assembly for LED chip packaging
A technology for LED chips and components, applied in electrical components, semiconductor devices, circuits, etc., can solve problems such as affecting the service life of LED packaging brackets, inconvenient disassembly and assembly, and weak packaging.
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
Method used
Image
Examples
Embodiment Construction
[0023]Next, the technical solutions in the embodiments of the present invention will be apparent from the embodiment of the present invention, and it is clearly described, and it is understood that the described embodiments are merely embodiments of the present invention, not all of the embodiments. Based on the embodiments in the present invention, those of ordinary skill in the art will belong to the scope of the present invention in the scope of the present invention without any other embodiments obtained without creative labor.
[0024]SeeFigure 1-5 The present invention is a bracket assembly for the LED chip package, including the bottom case 1 and the sealing cover 2, the outer side wall of the sealing cover and the inner wall of the bottom box 1;
[0025]The bottom case 1 is opened with a plurality of grooves 101, and the groove 101 is fixed to the inner wall fixing a restricted spring 102, and the limit spring 102 is fixedly connected to the block 103, the block 103 side is slid i...
PUM
Abstract
Description
Claims
Application Information
- R&D Engineer
- R&D Manager
- IP Professional
- Industry Leading Data Capabilities
- Powerful AI technology
- Patent DNA Extraction
Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.
© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com