Integrated isolation packaging structure

Abstract

The invention relates to an integrated isolation packaging structure. The integrated isolation packaging structure comprises a mounting base, wherein the mounting base is composed of an upper cavity,a lower cavity and a partition layer arranged between the upper chamber and the lower chamber, the upper chamber is sealed and packaged through an upper cover, the lower chamber is sealed and packagedthrough a lower cover, a segmentation layer is used for completely segmenting the upper chamber and the lower chamber, the upper chamber is used for installing a sensor chip, and the lower chamber isused for installing a sensor excitation and test circuit. The integrated isolation packaging structure is advantaged in that a mode of dividing an upper part and a lower part into two independent cavities is adopted, the sensor chip and a matched circuit thereof are completely isolated, influence of the circuit part on the sensor chip is avoided, the long-term packaging stability is good, the size is small, and batch production can be realized.

Description

technical field [0001] The invention belongs to the technical field of sensors, and in particular relates to an integrated isolation packaging structure. Background technique [0002] In the design and manufacture process of the sensor, the packaging of the sensor plays a key role in its performance. The purpose of the packaging of the sensor is to integrate the chip and supporting circuits into a housing to ensure that the chip is free from the influence of the external environment and stable. Works well and does what it should. [0003] The packaging of general sensors requires vacuum or filling inert gas, etc. At present, the existing packaging structure usually adopts the circuit and chip in a chamber for sealing. The problem with this packaging method is that the water vapor inside the electronic components is difficult to clean. It will affect the vacuum level and long-term stability inside the package. First of all, during the long-term storage of the device, the wa...

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Problems solved by technology

Secondly, during the use of the device, there must be the possibility of high and low temperature in a complex environment. The water vapor inside the electronic component will evaporate when the sensor is high temperature, and it will take a long time to return to the inside of the component when the temperature is low, that is, The state of the chip is different at high and low temperature, which causes the inconsistency of the high and low temperature test performance of the sensor, which is mainly reflected in the temperature drift, linearity, hysteresis and other performance of the sensor

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