Array antenna and base station

An array antenna and dielectric substrate technology, applied in the wireless field, can solve the problems of time-consuming and labor-intensive assembly and poor consistency

Inactive Publication Date: 2020-07-28
AAC TECH PTE LTD
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0003] The present invention provides a 5G base station array antenna based on the plastic electroplating process. Aiming at the problems of time-consuming and labor-intensive assembly and poor consistency of the welding process in the prior art, the 5G base station is realized by adopting the differential coupling feeding technology and the processing technology of plastic electroplating. Antenna broadband, low cost, miniaturization and light weight requirements

Method used

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  • Array antenna and base station

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Embodiment Construction

[0023] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

[0024] Please refer to figure 1 , figure 2 with image 3 , the present invention provides an array antenna 100 applied to a 5G base station, the array antenna 100 includes a bottom plastic dielectric substrate 10, a first top plastic dielectric substrate 31 fixed to the bottom plastic dielectric substrate 10, and a second top plastic dielectric substrate The substrate 32, the feed network 13 disposed on the bottom plastic dielectric substrate 10, and the fi...

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Abstract

The invention relates to the field of wireless technologies, and provides an array antenna, an antenna subarray and a base station. The array antenna comprises a bottom-layer plastic dielectric substrate, a plastic bulge arranged on the bottom-layer plastic dielectric substrate, a top-layer plastic dielectric substrate stacked on the plastic bulge, and a radiation unit, wherein the radiation unitis electroplated on the surface, which is away from the bottom-layer plastic dielectric substrate, of the top-layer plastic dielectric substrate. The array antenna further comprises a feed network electroplated and printed on the bottom-layer plastic dielectric substrate and the plastic bulge, wherein the feed network comprises a one-to-two power divider and a differential coupling feed circuit electrically connected with the one-to-two power divider. In addition, the invention also provides a base station applying the array antenna. Compared with the prior art, the requirements of wide band,low cost, miniaturization and light weight of the 5G base station antenna are met by adopting a differential coupling feed technology and a plastic electroplating processing technology.

Description

【Technical field】 [0001] The invention relates to the field of wireless technology, in particular to an array antenna and a base station. 【Background technique】 [0002] With the advent of the fifth-generation mobile communication technology, massive array antenna (Massive MIMO) technology will be widely used in the design of 5G base station antennas to improve data transmission rates and spectrum utilization. Traditional Massive MIMO base station antennas use PCB or metal parts as the carrier of the antenna radiation unit and the feed network, and are connected and fixed by welding process, which will inevitably lead to time-consuming and laborious antenna assembly, poor consistency, and increase the weight of the antenna and antenna design costs. 【Content of invention】 [0003] The present invention provides a 5G base station array antenna based on the plastic electroplating process. Aiming at the problems of time-consuming and labor-intensive assembly and poor consiste...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01Q1/38H01Q21/24
CPCH01Q1/38H01Q21/24
Inventor 吕洪辉
Owner AAC TECH PTE LTD
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