Enameled wire glue pouring assistive device and preparation method of enameled wire grinding and polishing sample

Abstract

The invention discloses an enameled wire glue pouring assistive device and a preparation method of an enameled wire grinding and polishing sample, and belongs to the technical field of enameled wire section grinding. The enameled wire glue pouring assistive device comprises a forming die and a perpendicularity positioning plate. A glue filling space with an opening in one end is formed in the forming mold; the perpendicularity positioning plate is arranged in the glue pouring space; the perpendicularity positioning plate comprises a horizontal section and vertical sections at the two ends of the horizontal section. A plurality of vertical positioning grooves which are distributed at intervals are formed in the outer side of the vertical section; the vertical positioning groove and the grinding and polishing line sample are positioned and matched and then are bonded and connected. The device has the following beneficial effects: the enameled wire glue pouring assistive device is simplein structure, low in use cost and high in universality, the perpendicularity of enameled wire grinding and polishing samples during glue pouring is guaranteed by applying the glue pouring assistive device to prepare the grinding and polishing samples, the real coating quality of enameled wire paint films can be accurately reflected, interval arrangement of the grinding and polishing samples is guaranteed, the number of the grinding and polishing samples is increased and the reliability of detection results is improved.

Description

technical field [0001] The invention relates to the technical field of enameled wire section grinding, in particular to an enameled wire glue potting auxiliary tool and a preparation method for enameled wire grinding and polishing samples. Background technique [0002] The inspection of enameled wire paint film coating quality is generally judged by observing the cross section of enameled wire. The existing technology to obtain the enameled wire cross section is to place the enameled wire in the mold after winding, or insert multiple enameled wires into the corresponding mold, and then pour glue in the mold. After hardening, take out the formed sample and use The manual grinding and polishing machine is used for grinding and polishing, and finally the conductor and insulating layer in the cross-section are confirmed through a microscope. [0003] The problems and defects in the prior art are as follows: 1. No matter whether the enameled wire is wound or directly put into th...

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Problems solved by technology

[0003] The problems and defects in the prior art are as follows: 1. No matter whether the enameled wire is wound or directly put into the mold, the verticality of the enameled wire cannot be well guaranteed, and the enameled wire is likely to be skewed during the glue filling process, making the grinding The final enameled wire section is an inclined section, which cannot accurately reflect the real coating quality of the enameled wire paint film; 2. Due to the shape of the enameled wire and the structural limitations of the mold, there are fewer enameled wires placed in the mold, which reduces the test efficiency. Some of the spacing between them cannot be guaranteed, so that the shape and shape of the enameled wire cross section cannot be clearly observed, which affects the reliability of the test results; 3. The method of making the grinding and polishing samples is not uniform, which is inconvenient for unified management

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