Chip packaging structure and packaging method

Abstract

The invention discloses a chip packaging structure and a packaging method, the packaging structure comprises a first circuit board, a substrate, a first chip, a first metal ball, a second circuit board, a second chip and a second metal ball, the first circuit board comprises a first surface and a second surface which are oppositely arranged, and a through hole penetrating through the first surfaceand the second surface; the substrate is located on the first surface and covers the through hole; the first chip is located at one side, facing the through hole, of the substrate, and the first chipextends towards the through hole; the first metal ball is connected with the substrate and the first surface; the second circuit board is located on the second surface and covers the through hole; the second chip is located at one side, facing the through hole, of the second circuit board, and the second chip extends towards the through hole; and the second metal ball is connected with the secondcircuit board and the second surface. The first metal ball and the second metal ball not only can effectively adjust the distance between the first chip and the second chip, but also can realize signal transmission.

Description

technical field [0001] The invention relates to the technical field of chip packaging, in particular to a chip packaging structure and packaging method. Background technique [0002] With the continuous development of science and technology, more and more electronic devices are widely used in people's daily life and work, which brings great convenience to people's daily life and work, and has become an indispensable and important tool for people today. tool. [0003] The main component of electronic equipment to achieve preset functions is the chip. With the continuous advancement of integrated circuit technology, the integration of the chip is getting higher and higher, the function of the chip is getting more and more powerful, and the size of the chip is getting smaller and smaller, so the chip needs The packaging structure is formed by packaging, so as to facilitate the electrical connection of the chip with the external circuit board. [0004] In the prior art, refer ...

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Problems solved by technology

[0007] In the prior art, the first chip 11 is fixed on the frame 13, the second chip 12 is fixed on the substrate 14, and the end of the frame 13 is fixed to the substrate 14 through the glue 15. At this time, mainly by controlling the glue 15 To adjust the distance B between the first chip 11 and the second chip 12, this adjustment method needs to use special equipment and materials, the cost is high, the processing time is long, and the yield is low

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