Micro electro mechanical system pump module

A technology of electric pumps and microcomputers, applied in the direction of pumps, pump control, mechanical equipment, etc., can solve the problems of large area of ​​control electrode 91a, and chip cost cannot be reduced

Active Publication Date: 2020-08-07
MICROJET TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] However, the control electrode 91a contained in the chip-based fluid delivery device often occupies a large area, so that the cost of the chip cannot be reduced.

Method used

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  • Micro electro mechanical system pump module
  • Micro electro mechanical system pump module
  • Micro electro mechanical system pump module

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Embodiment Construction

[0021] The embodiments embodying the features and advantages of this case will be described in detail in the later description. It should be understood that the case can have various changes in different aspects, which do not depart from the scope of the case, and the descriptions and diagrams therein are essentially for illustrative purposes, rather than limiting the case.

[0022] See figure 2 In the first embodiment of the present case, the MEMS pump module 100I includes a MEMS chip 100. The MEMS chip 100 includes a chip body 10, a plurality of MEMS pumps 20, at least one first control electrode 30I, a plurality of first connection points 31, at least one second control electrode 40I, and a plurality of second connection points 41. The chip body 10 has a rectangular shape and has two opposite long sides 11 and two opposite short sides 12. The MEMS pump 20 is disposed on the chip body 10, and each MEMS pump 20 has a first electrode 21a and a second electrode 21b, respectively...

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PUM

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Abstract

The invention discloses a micro electro mechanical system pump module. The micro electro mechanical system pump module comprises a micro electro mechanical system chip; the micro electro mechanical chip comprises a chip body, a plurality of micro electro mechanical system pumps, a plurality of first connecting points, a plurality of second connecting points, at least one first control electrode and at least one second control electrode; the micro electro mechanical system chip comprises a chip body and is in a rectangular shape and is provided with two long edges and two short edges; the microelectro mechanical system pumps are arranged on the chip body, and each micro electro mechanical system pump is provided with a first electrode and a second electrode; the plurality of first connecting points are arranged on the chip body and are electrically connected with the first electrodes of the micro electro mechanical system pumps; the plurality of second connecting points are arranged onthe chip body and are electrically connected with the second electrodes of the micro electro mechanical system pumps; the at least one first control electrode is arranged on the chip body and is electrically connected with the first connecting points; and at least one second control electrode is arranged on the chip body and is electrically connected with the second connection points. The at least one first control electrode and the at least one second control electrode are arranged on two opposite sides of the chip body respectively.

Description

【Technical Field】 [0001] This case is about a MEMS pump module, especially a MEMS pump module that uses a novel layout method to reduce the chip area. 【Background technique】 [0002] With the rapid development of science and technology, the traditional fluid conveying device has been moving towards miniaturization of the device and maximum flow rate. The application is also becoming more and more diversified, from industrial applications, biomedical applications, medical care, electronic heat dissipation to recently popular wearable devices, it can be seen. [0003] In recent years, micro-electromechanical-related manufacturing processes have been integrated to achieve the chipization of fluid delivery devices, such as figure 1 As shown, the conventional MEMS pump module 9 includes a chip body 90 and a plurality of MEMS pumps 91. A plurality of microelectromechanical pumps 91 are integrally formed on the chip body 90, and each microelectromechanical pump 91 has a plurality of cont...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): F04B49/06F04B19/00F04B17/03
CPCF04B49/065F04B19/006F04B17/03
Inventor 莫皓然余荣侯张正明戴贤忠廖文雄黄启峰韩永隆蔡长谚
Owner MICROJET TECH
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