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MEMS pump module

A technology of electric pumps and microcomputers, applied in pumps, pump control, mechanical equipment, etc., can solve problems such as the inability to reduce the chip cost and the large area of ​​the control electrode 91a

Active Publication Date: 2022-06-28
MICROJET TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] However, the control electrode 91a contained in the chip-based fluid delivery device often occupies a large area, so that the cost of the chip cannot be reduced.

Method used

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Embodiment Construction

[0021] Embodiments embodying the features and advantages of the present case will be described in detail in the description of the latter paragraph. It should be understood that this case can have various changes in different aspects, all of which do not depart from the scope of this case, and the descriptions and diagrams therein are essentially used for illustration rather than limiting this case.

[0022] see figure 2 , In the first embodiment of the present case, the MEMS pump module 100I includes a MEMS chip 100 . The MEMS chip 100 includes a chip body 10 , a plurality of MEMS pumps 20 , at least one first control electrode 30I, a plurality of first connection points 31 , at least one second control electrode 40I and a plurality of second connection points 41 . The chip body 10 has a rectangular shape and has two opposite long sides 11 and two opposite short sides 12 . The MEMS pumps 20 are disposed on the chip body 10 , and each MEMS pump 20 has a first electrode 21 a...

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Abstract

A microelectromechanical pump module includes a microelectromechanical chip. The microelectromechanical chip includes: a chip body, which is a rectangular shape, with two long sides and two short sides; a plurality of microelectromechanical pumps, which are arranged on the chip body, and respectively have a first electrode and a second electrode; The first connection point is arranged on the chip body and is electrically connected to the first electrode of the microelectromechanical pump; a plurality of second connection points is arranged on the chip body and is electrically connected to the second electrode of the microelectromechanical pump; at least one first The control electrode is arranged on the chip body and is electrically connected to the first connection point; and at least one second control electrode is arranged on the chip body and is electrically connected to the second connection point. At least one first control electrode and at least one second control electrode are respectively disposed on opposite sides of the chip body.

Description

【Technical field】 [0001] This case is about a micro-electro-mechanical pump module, especially a micro-electro-mechanical pump module that uses a novel layout to reduce the chip area. 【Background technique】 [0002] With the rapid development of science and technology, the traditional fluid delivery device has moved towards the miniaturization of the device and the maximization of the flow. Its applications are also becoming more and more diversified. It can be seen in industrial applications, biomedical applications, medical care, electronic cooling, and recently popular wearable devices. [0003] In recent years, the micro-electromechanical related process has achieved the chipization of the fluid delivery device by means of integral molding, such as figure 1 As shown, the conventional MEMS pump module 9 includes a chip body 90 and a plurality of MEMS pumps 91 . A plurality of MEMS pumps 91 are integrally formed on the chip body 90, and each MEMS pump 91 has a plurality ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): F04B49/06F04B19/00F04B17/03
CPCF04B49/065F04B19/006F04B17/03
Inventor 莫皓然余荣侯张正明戴贤忠廖文雄黄启峰韩永隆蔡长谚
Owner MICROJET TECH
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