Heat-resistant epoxy resin preparation device
A technology for epoxy resin preparation and heat resistance, which is applied in feeding devices, chemical instruments and methods, chemical/physical processes, etc., can solve problems such as difficulty in feeding, and achieve the effect of convenient adjustment
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Embodiment 1
[0031] Such as figure 1 A heat-resistant epoxy resin preparation device shown includes a reaction kettle 1 and a recovery device 2 installed under the reaction kettle 1 , and a feeding device 3 is provided on the right side of the reaction kettle 1 .
[0032] Such as Figure 2 to Figure 3 As shown, the recovery device 2 includes a support base plate 4 and a support top plate 5 set up symmetrically, the left and right edges of the top surface of the support top plate 5 are fixedly equipped with connecting brackets 6, and the reaction kettle 1 is fixedly installed in the connecting brackets 6;
[0033] A recovery adjustment mechanism 7 is installed between the supporting bottom plate 4 and the supporting top plate 5;
[0034] The recovery adjustment mechanism 7 comprises a first recovery box 21 and a second recovery box 22 set up symmetrically, a first rotation mechanism 23 is provided below the first recovery box 21, and a second rotation mechanism is provided below the second...
Embodiment 2
[0044] This embodiment provides a method for preparing a heat-resistant epoxy resin, which includes the following raw materials in parts by weight: 10wt% modified polysulfide rubber and 90wt% bisphenol A epoxy resin.
[0045] Preparation:
[0046] Preparation of modified polysulfide rubber
[0047] a. Put the polytetrahydrofuran ether glycol into the reaction kettle 1 through the storage tank 313, and dehydrate the polytetrahydrofuran ether glycol for 2 hours at 80-90°C. After the dehydration is completed, cool to room temperature under vacuum, and then After the completion, feed nitrogen into the reaction kettle 1 for protection, gradually add excess toluene diisocyanate, the molar ratio of polytetrahydrofuran ether glycol and toluene diisocyanate is 1:2, after the addition is completed, react at 80-90°C for 1 hour , to obtain a terminal isocyanate group prepolymer;
[0048] b. Lower the temperature of the isocyanate-terminated prepolymer. After cooling down to room tempera...
Embodiment 3
[0053] This embodiment provides a method for preparing a heat-resistant epoxy resin, which includes the following raw materials in parts by weight: 15wt% modified polysulfide rubber and 85wt% bisphenol A epoxy resin.
[0054] The preparation method of the above heat-resistant epoxy resin is the same as in Example 2.
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