A high-temperature cooking packaging film with strong solvent resistance and low precipitation
A solvent-resistant, high-temperature cooking technology, applied in the field of packaging, can solve the problems of low polyethylene strength and heat resistance, deformed appearance of strips, pad marks, squeeze marks or indentations, etc., to achieve strong solvent resistance, Effect of avoiding precipitation and reducing voids
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
Method used
Image
Examples
Embodiment 1
[0029] A high-temperature cooking packaging film with strong solvent resistance and low precipitation, the outer layer is PET, and the thickness of PET is 12 μm; the first connecting layer is modified high-density polyethylene, and the Vicat softening point of the modified high-density polyethylene is above 125°C, the thickness of the first connection layer is 10 μm; the barrier layer is aluminum foil, and the thickness of the barrier layer is 7 μm; the second connection layer is modified high-density polyethylene, and the thickness of the second connection layer is 8 μm; the inner The layer is a three-layer blown composite film, which is a cyclic olefin copolymer layer, a high-density polyethylene layer, and a copolymerized polypropylene layer from the inside to the outside; no additives are added to the inner layer, and the thickness of the cyclic olefin copolymer layer is 5 μm, the thickness of the high-density polyethylene layer is 10 μm, and the thickness of the copolymeri...
Embodiment 2
[0034]The difference between Example 2 and Example 1 is that a high-temperature cooking packaging film with strong solvent resistance and low precipitation, the outer layer is BOPP, and the thickness of BOPP is 20 μm; the first connecting layer is modified high-density polyethylene, The Vicat softening point of modified high-density polyethylene is above 125°C, the thickness of the first connection layer is 15 μm; the barrier layer is EVOH, and the thickness of the barrier layer is 10 μm; the second connection layer is high-density metallocene polyethylene and ethylene - a mixture of methacrylic acid-acrylate copolymer, the mass ratio of high-density metallocene polyethylene to ethylene-methacrylic acid-acrylate copolymer=3:1, the thickness of the second connection layer is 10 μm; the inner layer It is a three-layer casting film, which is a cyclic olefin copolymer layer, a copolymerized polypropylene layer, and a cyclic olefin copolymer layer from the inside to the outside; no ...
Embodiment 3
[0038] The difference between Example 3 and Example 1 is: a high-temperature cooking packaging film with strong solvent resistance and low precipitation, the outer layer is PET, and the thickness of PET is 20 μm; the first connecting layer is high-density metallocene polyethylene and A mixture of ethylene-methacrylic acid-acrylate copolymer, the mass ratio of high-density metallocene polyethylene to ethylene-methacrylic acid-acrylate copolymer=3:1 Among them, the thickness of the first connection layer is 10μm; the barrier layer It is a silicon-coated OPP film, and the thickness of the barrier layer is 7 μm; the second connection layer is modified high-density polyethylene, and the thickness of the second connection layer is 8 μm; the inner layer is a three-layer blown composite film, from inside to outside The sequence is a copolymerized polypropylene layer, a cyclic olefin copolymer layer, and a copolymerized polypropylene layer; no additives are added to the inner layer, whe...
PUM
| Property | Measurement | Unit |
|---|---|---|
| thickness | aaaaa | aaaaa |
| thickness | aaaaa | aaaaa |
| softening point | aaaaa | aaaaa |
Abstract
Description
Claims
Application Information
Login to View More 


