LED transfer head for micro LED

Abstract

The present invention relates to a micro LED transfer head transferring a micro light-emitting diode (micro LED) from a first substrate to a second substrate. More particularly, the present inventionrelates to a micro LED transfer head, in which the lowering position of the micro LED transfer head is limited.

Description

technical field [0001] The present invention relates to a micro light emitting diode (LED) transfer head for transferring micro light emitting diodes (LEDs) from a first substrate to a second substrate. Background technique [0002] Currently, liquid crystal displays (liquid crystal displays, LCDs) are still the mainstream in the display market, but organic light emitting diodes (organic light emitting diodes, OLEDs) rapidly replace LCDs and gradually become the mainstream. In the current situation where display companies are actively participating in the OLED market, recently Micro LED (Micro LED) (hereinafter referred to as "micro LED") displays are gradually becoming another next-generation display. Micro LED does not refer to the package type covered with molded resin, etc., but refers to the state cut out from the wafer used for crystal growth. The core raw materials of LCD and OLED are liquid crystal (Liquid Crystal) and organic materials, respectively. On the contrar...

AI Technical Summary

Problems solved by technology

Compared with the electrostatic head method, this method does not have the problem of damaging the micro-LED, but has the following disadvantages: During the transfer process, the micro-LED can be transferred stably only if the adhesive force of the elastic transfer head is greater than the adhesive force of the target substrate, and requires Additional processes for forming electrodes

However, conventional invention 4 has the following disadvantages: continuous use of adhesive is required, and micro LEDs may be damaged when the roller is pressed

However, the existing invention 5 has the following disadvantages: a separate solution is required for transferring the micro LED to the array substrate by immersing it in the solution, and a drying process is required after that

However, the existing invention 6 has the following disadvantages: it is a method of transferring an adhesive substance with adhesive force to the bonding surfaces of a plurality of pick-up heads to transfer micro LEDs, so it is necessary to apply the adhesive substance to the surface of the pick-up heads. separate process

Therefore, excessive pressure will be applied to the micro LED 100 that is first adsorbed by the adsorption part 2, causing damage to the micro LED 100.

Images