Air-cooled mainframe chassis with internal environment temperature adjustment function and method

Abstract

The present invention relates to an air-cooled main engine box with the function of adjusting the internal environment temperature and a method thereof. The main engine box includes a main engine box; the main engine box includes a left panel and a right panel; A CPU is fixed on the board; a turntable, a rotating assembly, a lower fan plate, a first heat dissipation assembly and a second heat dissipation assembly are arranged in the host chassis; the first heat dissipation assembly includes a first iron block, a heat conduction needle group, and a first Return spring; the second heat dissipation assembly includes a second iron block, a mounting plate, a first cooling fin group, and a second return spring; an upper fan plate is also arranged in the host chassis; the upper fan plate and the horizontal plate of the mounting plate The body is fixed; the lower fan plate is an iron plate, and the right side surface is fixed with an electromagnet; the right side plate is provided with a first movable slot; the first movable slot is used for the heat conduction needle group or the first cooling fin group to pass through Mainframe chassis; the heat dissipation methods of this chassis are flexible and diverse, heat absorption and heat dissipation are more efficient, and the dustproof effect is good.

Description

technical field [0001] The present invention relates to the technical field of mainframe chassis, and more specifically, relates to an air-cooled mainframe chassis with an internal environment temperature adjustment function and a method thereof. Background technique [0002] The computer case is mainly used to place and fix various computer accessories, including the main control board. When dissipating heat, or directly fix a fan in the chassis, so that it continues to blow air towards the CPU. In this way, the fan, the main control board and the electronic components on the main control board are easy to be attached by dust; or directly on the The main control board is covered with a layer of heat-conducting silica gel. In this way, the heat-conducting silica gel is fixed. After absorbing heat, it cannot directly dissipate heat outside the computer case, and the heat dissipation speed is slow. Contents of the invention [0003] The technical problem to be solved by the...

AI Technical Summary

Problems solved by technology

When dissipating heat, or directly fix a fan in the case to make it continuously blow toward the CPU, in this way, the fan, the main control board and the electronic components on the main control board are easy to be attached by dust; or directly on the The main control board is covered with a layer of heat-conducting silica gel. In this way, the heat-conducting silica gel is fixed. After absorbing heat, it cannot directly dissipate heat outside the computer case, and the heat dissipation speed is slow.

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