Element package comparison method and related device

Abstract

The embodiment of the invention provides an element package comparison method and a related device, and aims at a first element package and a second element package. Because the first element packageand the second element package adopt the same package template, the appearance sizes of the first element package and the second element package are the same. Based on this, the first element packageand the second element package can be aligned by selecting a point on the package template as a comparison reference point of the first element package and the second element package. The comparison reference point is equivalent to a standard for comparing the first element package and the second element package. First packaging information of the first element package and second packaging information corresponding to the second element package can be determined according to the position of the relative comparison reference point. By comparing the first packaging information with the second packaging information to generate differentiated packaging information, automatic comparison of the first element packaging and the second element packaging is realized, and the comparison efficiency ofthe element packaging is improved.

Description

technical field [0001] The present application relates to the technical field of printed electronic circuits, in particular to a component packaging comparison method and a related device. Background technique [0002] During the research and development process of a printed circuit board (Printed Circuit Board, PCB), it is necessary to constantly modify the design of the component package (footprint) to meet the needs of customers. Regardless of whether it is a server motherboard or a small board, there is a situation where the customer provides a reference version, and the customer hopes that part of the footprint on the designed PCB is the same as the footprint on the reference version. In order to meet the needs of customers, engineers usually change the design on the basis of the original PCB. However, to make changes to the original PCB, it is necessary to know the difference between the footprint in the existing factory component library and the reference footprint p...

AI Technical Summary

Problems solved by technology

However, to make changes to the original PCB, it is necessary to know the difference between the footprint in the existing factory component library and the reference footprint provided by the client. Therefore, the engineer needs to manually compare the footprints on the two PCBs.

However, a large footprint may have hundreds of pins (PIN) or even thousands of PINs. Manually comparing two footprints is time-consuming and labor-intensive, and the work efficiency is low.

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