Digital special LED packaging structure and production process thereof

A technology of LED packaging and production technology, which is applied in the direction of electrical components, circuits, semiconductor devices, etc., can solve the problems of large LED light-emitting angle, color cast, uneven light color of the LED body, etc., achieve high luminous efficiency and enhance reflective performance , the effect of small light emitting surface

Pending Publication Date: 2020-08-18
广西欣亿光电科技有限公司
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Problems solved by technology

[0002] At present, most of the conventional digital LED packaging forms on the market use glass fiber boards and epoxy resin colloid structures through injection molding. Such structures have the problem of large LED light-emitting angles and difficult control of the center of the light-emitting crystals, resulting in the light color of the LED body. Uneven, color cast defects

Method used

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  • Digital special LED packaging structure and production process thereof
  • Digital special LED packaging structure and production process thereof

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Embodiment Construction

[0024] In order to make the object, technical solution and advantages of the present invention clearer, the present invention will be further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described here are only used to explain the present invention, not to limit the present invention.

[0025] refer to figure 1 and figure 2 A special digital LED packaging structure is shown, which includes a base 1 with a protrusion on the base 1 and a groove on the protrusion. The groove is circular or square, usually in the shape of a bowl In some embodiments, the groove is square, and the corners of the square groove are rounded, and the LED chip 4 is arranged in the groove, and the LED chip 4 can be pasted on the base 1 by a die-bonding glue. , the bottom of the groove is coated with a layer of reflective layer 3, which can be formed by gold-plated, silver-plated or aluminum-plated, the pur...

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Abstract

The invention belongs to the technical field of LEDs, and particularly relates to a digital special LED packaging structure and a production process thereof. The LED packaging structure comprises: a base; a bulge arranged on the base, wherein a groove is formed in the bulge; a LED wafer arranged in the groove; a reflecting layer which is arranged at the bottom of the groove; an electrode pin whichis connected with the LED wafer through a wire; and a filling layer which is arranged in the groove so as to package the LED wafer, wherein the end surface of the filling layer is concave inwards. According to the digital special LED packaging structure, the bulge is arranged on the base, the groove is arranged in the bulge, the LED wafer is arranged in the groove, after the LED wafer is packagedby the filling layer, the end face of the filling layer is concave inwards, the LED packaging structure has the advantages of being small in light-emitting surface and high in light-emitting efficiency, and the reflection layer is arranged at the bottom of the groove, so that the light reflection performance of the LED packaging structure is enhanced.

Description

technical field [0001] The invention belongs to the technical field of LEDs, and in particular relates to a special digital LED packaging structure and production process. Background technique [0002] At present, most of the conventional digital LED packaging forms on the market use glass fiber boards and epoxy resin colloid structures through injection molding. Such structures have the problem of large LED light-emitting angles and difficult control of the center of the light-emitting crystals, resulting in the light color of the LED body. Uneven, color cast defects. Contents of the invention [0003] In order to solve the above-mentioned problems in the prior art, the present invention provides a special digital LED packaging structure and a production process of the LED packaging structure. [0004] In order to solve the problems of the technologies described above, the present invention adopts the following technical solutions: [0005] A special digital LED packagi...

Claims

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Application Information

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IPC IPC(8): H01L33/48H01L33/54H01L33/60H01L33/62
CPCH01L33/48H01L33/54H01L33/60H01L33/62H01L2933/0033H01L2933/005H01L2933/0058H01L2933/0066
Inventor 吴先泉
Owner 广西欣亿光电科技有限公司
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