A flip-chip white light LED device and manufacturing method thereof

Abstract

The invention provides a flip white-light LED device and a manufacturing method thereof. The flip white-light LED device comprises a wavelength conversion layer and a light emitting unit, wherein the light emitting unit is of a flip-chip structure; a second semiconductor layer of the light emitting unit extends outwardly to form a projection part, so that the light emitting unit is of an inverted T structure; the wavelength conversion layer fully covers an epitaxial layer substrate, a first semiconductor layer and an active layer of the light emitting unit, and reaches the upper surface of the projection part without covering the second semiconductor layer and a conventional electrode metal layer of the light emitting unit; and a through hole is formed between the conventional electrode metal layer and the first semiconductor layer, the through hole only penetrates the conventional electrode metal layer, the second semiconductor layer and the active layer, is used for the electrical connection of a first electrode and the first semiconductor layer, and is used for the electrical connection of a second electrode and the second semiconductor layer. The flip white-light LED device provided by the invention is high in reliability and has good light emitting effect; and the manufacturing method of the flip white-light LED device is simple in steps, reduces production cost, and effectively increases productivity.

Description

technical field [0001] The invention belongs to the technical field of LEDs, and in particular relates to a flip-chip white light LED device and a manufacturing method thereof. Background technique [0002] A light emitting diode (LED) is a semiconductor device that is excited to generate light of various colors in response to an electric current, and has the advantages of high efficiency, long life, and no harmful substances such as Hg. With the rapid development of LED technology, the brightness and lifespan of LEDs have been greatly improved, making the application of LEDs more and more extensive. From outdoor lighting such as street lights to urban lighting such as decorative lights, they are all used or Replace with LED as light source. [0003] In the semiconductor lighting industry, the structure of LED chips is generally divided into three types: front chip structure, vertical chip structure and flip chip structure. Compared with the other two chip structures, the ...

AI Technical Summary

Problems solved by technology

[0005] However, for this type of traditional packaging structure, due to the different thermal expansion coefficients of the bracket, the fluorescent glue on the LED chip, and the packaging glue, there are certain hidden dangers in the reliability of the package; moreover, for this packaging structure, the fluorescent material is easy to coat Uneven coverage and inconsistent thickness will lead to problems such as uneven white light color and color cast

[0006] In addition, in the existing market, LED brackets are mostly made of PPA, PCT or EMC materials, and these materials have major defects in high temperature resistance, air tightness, etc.

Although the ceramic bracket has good high temperature resistance and air tightness, the cost of the ceramic bracket is close to the cost of the chip, and because the side wall cannot be covered by phosphor powder, it is easy to leak blue light, and the manufacturing cost required for the ceramic bracket to package the LED is expensive. The investment in equipment is large, which leads to the small production capacity and high price of LED products with ceramic brackets

[0007] In other words, the shortcomings of traditional flip-chip white LED products in terms of reliability, light output effect, manufacturing cost and price have become a major obstacle to their replacement of traditional lighting products.

Images