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LED device and manufacturing method thereof

A technology of an LED device and a manufacturing method, applied in the field of lighting, can solve the problems of small light-emitting surface, poor heat dissipation performance, high power, etc., and achieve the effects of reducing the light-emitting surface, increasing power, and improving heat dissipation performance

Pending Publication Date: 2021-06-04
NINGBO SUNPU OPTO SEMICON
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

Therefore, no matter what kind of chip is used, it needs to be packaged on an aluminum substrate or a ceramic substrate with solder paste or die-bonding glue. During use, the heat generated by the chip is first transferred to the bottom of the substrate through the solder paste or die-bonding glue, and then Then it is transferred to the heat sink, resulting in poor heat dissipation performance, which makes it impossible for LED devices to achieve higher power and smaller light-emitting surface

Method used

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  • LED device and manufacturing method thereof
  • LED device and manufacturing method thereof
  • LED device and manufacturing method thereof

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Embodiment Construction

[0043] In order to enable those skilled in the art to better understand the solution of the present application, the present application will be further described in detail below in conjunction with the drawings and specific implementation methods. Apparently, the described embodiments are only some of the embodiments of this application, not all of them. Based on the embodiments in this application, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the scope of protection of this application.

[0044] In the following description, a lot of specific details are set forth in order to fully understand the present invention, but the present invention can also be implemented in other ways different from those described here, and those skilled in the art can do it without departing from the meaning of the present invention. By analogy, the present invention is therefore not limited to the specific examples disclosed bel...

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Abstract

The invention discloses an LED device. The device comprises a DPC ceramic substrate which is provided with a chip bonding pad, wherein an LED chip is connected with the DPC ceramic substrate through the chip bonding pad; a box dam located on the surface of the DPC ceramic substrate and surrounding the outer side of the LED chip; a phosphor layer; and a packaging body positioned in the box dam. According to the LED device, the substrate is the DPC ceramic substrate, the DPC ceramic substrate is provided with the chip bonding pad, the LED chip is directly connected with the DPC ceramic substrate through the chip bonding pad, the LED chip and the DPC ceramic substrate do not need to be connected through solder paste or solid crystal glue, heat generated by the LED chip is directly transmitted to the DPC ceramic substrate for heat dissipation, the heat dissipation performance is improved, and therefore, the power of the LED device can be increased, and the light-emitting surface is reduced. In addition, the invention further provides a manufacturing method of the LED device with the advantages.

Description

technical field [0001] The present application relates to the technical field of lighting, in particular to an LED device and a manufacturing method thereof. Background technique [0002] Light Emitting Diodes (LEDs for short) are widely used in the field of lighting, and have the characteristics of energy saving, environmental protection, long life, and small size. In order to meet people's needs for light in different scenarios, LED light sources that can be dimmed and color-tuned have become a hot spot in industry research. [0003] The current dimmable and color-adjustable LED devices use an aluminum substrate or a ceramic substrate. One packaging method is to package the LED chip on the substrate with solder paste or solid crystal glue, and use solder paste or gold wire to connect the LED chip to the LED. The electrical connection between the chip, the LED chip and the bracket, and then the dimming and color adjustment can be realized by filling fluorescent glue with d...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L25/075H01L33/48H01L33/50H01L33/54H01L33/64
CPCH01L25/0753H01L33/483H01L33/507H01L33/54H01L33/642H01L2933/0033
Inventor 杜元宝张耀华蒋昌明朱小清张庆豪陈复生
Owner NINGBO SUNPU OPTO SEMICON
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