Wooden floor surface gumming device and working method thereof

Abstract

The invention discloses a wooden floor surface gumming device and a working method thereof. The wooden floor surface gumming device comprises a working platform, a floor transferring device fixedly mounted on the working platform, a floor conveyer and a movable retaining die. The movable retaining die is arranged, when the floor transferring device transfers a to-be-gummed floor to the movable retaining die, and a certain-angle included angle is formed between a movable lateral die and a fixed bottom die, so that a protective effect is played, plenty of adhesive is prevented from being sprayedon the working platform to avoid pollution to other component; and in addition, through arranging the floor conveyer, the floor finishing gumming operation can be timely transferred without pollutingthe gumming surface of the floor, the gumming quality is improved and following combined machining is facilitated.

Description

technical field [0001] The invention belongs to the technical field of floor processing, and in particular relates to a wooden floor surface gluing device and a working method thereof. Background technique [0002] Wooden flooring is a floor prepared by processing wood as a raw material. Among them, composite wood flooring has high plasticity and high strength, and can also meet the needs of reducing production costs. Several layers of composite wood flooring are bonded by glue, so when processing composite wood flooring, it is necessary to apply a layer of glue on the surface of each layer, and then bond the layers together; [0003] In the prior art, when sizing the surface of the floor, a large amount of glue is likely to leak onto the processing platform. On the one hand, the processing platform is polluted, and the polluted area is not concentrated, resulting in difficulty in handling. On the other hand, the local When sizing the surface of the board, it is also necess...

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Problems solved by technology

[0003] In the prior art, when sizing the surface of the floor, a large amount of glue is likely to leak onto the processing platform. On the one hand, the processing platform is polluted, and the polluted area is not concentrated, resulting in difficulty in handling. On the other hand, the local When sizing the surface of the board, it is also necessary to dry and dry the sizing surface, but when transferring the sizing floor, it is easy to cause pollution and damage to the sizing surface, thereby affecting the sizing effect, and it is also easy to use Glue adheres to the transfer device, which affects subsequent processing. In order to solve the above problems, the present invention provides the following technical solutions

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