Method and device for optimizing laser processing quality

Abstract

The invention discloses a method and a device for optimizing laser processing quality, which include an XY axis moving mechanism and a supporting device. During laser processing, the thin plate to be processed is supported by the supporting device, and the XY-axis moving mechanism is controlled in real time according to the laser spot movement of the laser equipment to move at the same acceleration and rate as the spindle XY-axis mechanism of the laser equipment. Realize the mobile support device, and always keep the center of the laser spot of the laser equipment and the center of the support area of ​​the support device relatively positive to ensure the support effect and effectively reduce the deformation and thermal influence of the workpiece due to high temperature and high pressure during processing, which is beneficial to the processing area. Heat dissipation and slag removal, and also avoid laser irradiation on the elastic thimble of the support device, prevent the elastic thimble from attaching to the surface of the elastic thimble and cause uneven processing surface, effectively improve the problem that the workpiece is easily broken during processing, and the processing quality is good .

Description

technical field [0001] The invention relates to the technical field of laser processing, in particular to a method and device for optimizing the quality of laser processing. Background technique [0002] With the development of integrated circuits and semiconductor industries, various types of substrates are widely manufactured, but the substrates in integrated circuits are hard, brittle, thin, etc. Traditional processing methods are not conducive to processing, and the yield rate is low. [0003] At present, laser processing is mainly used, but short-pulse laser processing has low efficiency and high cost, which is not conducive to industrialized mass production. Therefore, long-pulse high-energy laser is currently mainly used for processing. In the long-pulse high-energy laser processing process, due to the high laser energy, there will be a lot of slag, so it is necessary to assist air blowing on the processing surface or back to cool and remove the slag, but the thin pla...

AI Technical Summary

Problems solved by technology

[0002] With the development of integrated circuits and semiconductor industries, various types of substrates are widely manufactured, but the substrates in integrated circuits are hard, brittle, and thin. Traditional processing methods are not conducive to processing, and the yield rate is low.

[0003] At present, laser processing is mainly used, but short-pulse laser processing has low efficiency and high cost, which is not conducive to industrialized mass production, so long-pulse high-energy laser is currently mainly used for processing

In the long-pulse high-energy laser processing process, due to the high laser energy, there will be a lot of slag, so it is necessary to assist air blowing on the processing surface or back to cool and remove the slag, but the thin plate is easy to deform under high temperature and high pressure. , and even change the heated structure of the thin plate, resulting in damage to the appearance and microstructure

The existing technology is generally to place thimbles on the bottom of the thin plate. This method cannot flexibly deal with the problem of real-time changes in the processing area, and it is easy to make the processing position coincide with the position of the thimble. The laser will damage the thimble or slag will adhere to the thimble. Flat, even thin plate workpieces are directly broken, affecting the processing quality

At the same time, the arrangement of thimbles is not conducive to heat dissipation and slag discharge in the processing area, which has a huge impact on processing efficiency and quality

Images