The invention provides a
wafer-level acoustic function testing method and a supporting substrate, and relates to the technical field of
wafer-level testing. The method comprises the following steps: firstly, providing an
acoustic sensor wafer of which the surface is provided with a protection structure, and
thinning the
acoustic sensor wafer; a supporting substrate is provided, and the
acoustic sensor wafer and the supporting substrate are bonded through a bonding material to form a bonded wafer; wherein the supporting substrate is provided with a through hole window and a first slotting structure, the position of the through hole window corresponds to the position of a functional area of a wafer, and the position of the first slotting structure corresponds to the position of a
cutting channel of the wafer; then the bonding wafer is placed on the
cutting workpiece, and the protection structure on the surface of the bonding wafer is removed;
cutting the substrate of the acoustic sensor wafer along the cutting channel until the bonding material or the supporting substrate is exposed; and finally, the bonded wafer is taken down from the
cut workpiece, and a wafer-level acoustic function test is carried out. According to the scheme of the invention, the method has the advantages of acoustic fidelity, wafer-level operation robustness and inter-
chip acoustic isolation.