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Wire-to-board socket and wire-to-board connector assembly

A wire-to-board and socket technology, applied in the direction of connection, contact parts, conductive connection, etc., can solve the problems of inability to disassemble, easy wrong welding, low manufacturing efficiency, etc.

Pending Publication Date: 2020-08-25
SHENZHEN EVERWIN PRECISION TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] In view of this, it is necessary to provide a wire-to-board socket and a wire-to-board connector assembly to solve the problems of low manufacturing efficiency, inability to disassemble, and easy wrong welding caused by the direct welding of extremely small conductive wires on the printed circuit board.

Method used

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  • Wire-to-board socket and wire-to-board connector assembly
  • Wire-to-board socket and wire-to-board connector assembly
  • Wire-to-board socket and wire-to-board connector assembly

Examples

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Embodiment Construction

[0028] In order to make the purpose, technical solution and advantages of the present application clearer, the technical solution of the present application will be clearly and completely described below in conjunction with specific embodiments of the present application and corresponding drawings.

[0029] The direction of this application is defined by figure 1 The X direction shown is the front of the front-rear direction (or the longitudinal direction), the Y direction is the right side of the left-right direction (or the horizontal direction), and the Z direction is the upper direction of the up-down direction (or the vertical direction).

[0030] see figure 1 As shown, the wire-to-board connector assembly of the present application includes a socket A and a plug B inserted into the socket A.

[0031] see Figure 2 to Figure 5 As shown, the wire-to-board socket A includes a socket body 10 , a socket terminal 20 inserted in the socket body 10 , and a fixing member 30 fix...

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PUM

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Abstract

The invention discloses a wire-to-board socket, which comprises a socket body, a socket terminal inserted into the socket body, and a fixing member fixed in the socket body. The socket body comprisesa top wall, a bottom wall, a rear wall, a pair of side walls connected with the top wall, the bottom wall and the rear wall, and a plugging cavity; the rear end of the plugging cavity is opened to form a plugging opening; a socket terminal groove is formed in the rear wall in a front-and-back penetrating manner; the socket terminal comprises a base part, a blade contact part formed by extending backwards from the top of the base part, a welding pin formed at the bottom of the base part, and a fixing pin formed by extending backwards from the middle of the base part; the socket terminal groovecomprises an upper side groove for the blade contact part to be inserted into the plugging cavity, a lower side groove for fixing the fixing pin and a cross beam which is located between the upper side groove and the lower side groove and connected with the two transverse side walls of the socket terminal groove, and the base part abuts against the cross beam. The socket is suitable for the connection of very small conductive wires.

Description

technical field [0001] The present application relates to the field of electrical connectors, in particular to a wire-to-board socket and a wire-to-board connector assembly. Background technique [0002] According to some customers’ feedback, in some application fields, enameled wires (about 0.2-0.3mm in diameter) are directly soldered to the printed circuit board for electrical connection. technical issues below. In view of the above technologies, there is an urgent need for a wire-to-board connector that is pluggable and improves assembly efficiency. It is required that the line pitch is not greater than 0.8mm and the height is less than 1.8mm. Contents of the invention [0003] In view of this, it is necessary to provide a wire-to-board socket and a wire-to-board connector assembly to solve the problems of low manufacturing efficiency, inability to disassemble, and easy mis-soldering caused by direct welding of extremely small conductive wires on the printed circuit bo...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01R12/79H01R13/11H01R13/04H01R4/02
CPCH01R4/023H01R12/79H01R13/04H01R13/11
Inventor 张少灿
Owner SHENZHEN EVERWIN PRECISION TECH