Air-tightness testing method for non-cavity or multi-cavity multilayer ceramic substrates

Abstract

The invention discloses a method for detecting air tightness of a cavity-free or multi-cavity multilayer ceramic substrate. Step 1, assembling a vacuum joint; Step 2, laying a vacuum rubber; Step 3, positioning and sucking materials; Step 4, loading materials ; Step 5, during the synchronous movement of the positioning plate, its bottom will squeeze the top of the vacuum rubber below, so that the vacuum rubber and the bottom of the vacuum joint form a seal; when the two positioning plates are in contact with the multilayer ceramic substrate, The multilayer ceramic substrate is centered, and its outer edge forms an overlapping portion; step 6, the multilayer ceramic substrate is sealed: the elastic pressure frame seals and compresses the overlapping portion on the surface of the vacuum rubber, so that the cavity window is a sealed cavity; step 7. Air tightness detection. In the present invention, the entire detection process is automatically completed, the degree of automation is high, and the distance between the outer edge of the multilayer ceramic substrate and the edge of the cavity window can be accurately controlled, and the pressing position and pressing force are consistent, so that the air tightness detection The result is reliable and accurate.

Description

technical field [0001] The invention relates to the technical field of ceramic substrate detection, in particular to an air tightness detection method for a multi-cavity or multi-cavity multilayer ceramic substrate. Background technique [0002] The development of modern microelectronics technology is extremely rapid, especially various optoelectronic devices are gradually developing towards miniaturization, large-scale integration, high efficiency and high reliability. However, with the improvement of electronic system integration, its power density increases, the heat generated by the overall operation of electronic components and the system increases, and the increase of system operating temperature will cause the performance of semiconductor devices to deteriorate, device damage, delamination, etc., and even cause packaging. The chip burns out, so effective electronic packaging must solve the problem of heat dissipation of the electronic system. [0003] The substrate u...

AI Technical Summary

Problems solved by technology

The entire detection process has a low degree of automation and low detection efficiency

[0010] 2. During the detection process, the distance between the outer edge of the multilayer ceramic substrate and the edge of the cavity window should not be less than 0.5mm; however, when placing the multilayer ceramic substrate manually, it is difficult to grasp the distance, which makes the sealing detection effect not good

[0011] 3. When the multilayer ceramic substrate is manually placed above the cavity window and pressed tightly, the pressing position and pressing force are difficult to fix, thus making the sealing effect between the multilayer ceramic substrate and the vacuum rubber not good

In addition, if it is pressed in the middle of the multilayer ceramic substrate, it will not only fail to increase the sealing performance between the multilayer ceramic substrate and the vacuum rubber, but will damage the multilayer ceramic substrate.

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