Method for balancing loss of SiC MOS MMC sub-module devices
A sub-module and device technology, which is applied in the field of equalizing the loss of SiCMOS MMC sub-module devices, can solve problems affecting the output power quality of MMC, achieve rich applicable scenarios, and minimize junction temperature and loss
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
Method used
Image
Examples
Embodiment Construction
[0032] In order to make the object, technical solution and advantages of the present invention clearer, the present invention will be further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described here are only used to explain the present invention, not to limit the present invention. In addition, the technical features involved in the various embodiments of the present invention described below can be combined with each other as long as they do not constitute a conflict with each other.
[0033] In order to achieve the above object, the present invention provides a method for equalizing the loss of SiC MOS MMC sub-module devices, such as figure 1 shown, including the following steps:
[0034] S1. According to whether the SiC MOSFET channel is turned on when the bridge arm current direction of the MMC sub-module is from the source to the drain of the SiC MOSFET, the working mode ...
PUM
Login to View More Abstract
Description
Claims
Application Information
Login to View More 


