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Method for balancing loss of SiC MOS MMC sub-module devices

A sub-module and device technology, which is applied in the field of equalizing the loss of SiCMOS MMC sub-module devices, can solve problems affecting the output power quality of MMC, achieve rich applicable scenarios, and minimize junction temperature and loss

Active Publication Date: 2020-08-28
HUAZHONG UNIV OF SCI & TECH
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Problems solved by technology

[0004] In view of the above defects or improvement needs of the prior art, the present invention provides a method for equalizing the loss of the SiC MOS MMC sub-module device, which is used to solve the problem that the existing method will affect the output power quality of the MMC after loss equalization due to the change of the modulation strategy of the system technical issues

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[0032] In order to make the object, technical solution and advantages of the present invention clearer, the present invention will be further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described here are only used to explain the present invention, not to limit the present invention. In addition, the technical features involved in the various embodiments of the present invention described below can be combined with each other as long as they do not constitute a conflict with each other.

[0033] In order to achieve the above object, the present invention provides a method for equalizing the loss of SiC MOS MMC sub-module devices, such as figure 1 shown, including the following steps:

[0034] S1. According to whether the SiC MOSFET channel is turned on when the bridge arm current direction of the MMC sub-module is from the source to the drain of the SiC MOSFET, the working mode ...

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Abstract

The invention discloses a method for balancing the loss of SiC MOS MMC sub-module devices. According to the method, the working modes of sub-modules are divided into a synchronous rectification mode and a non-synchronous rectification mode, and based on the bidirectional conduction characteristic of a channel of a SiC MOSFET, the two working modes can be switched in a self-adaptive manner in the whole working period by continuously adjusting a current threshold value, so that the proportion of the two working modes in the whole working period is adjusted, and the loss minimization of MMC sub-module devices is realized; starting from the perspective of device control, the quality of electric energy output by a converter is not changed, the characteristic that a SiC MOSFET channel can conduct current in two directions is utilized, and the loss balance of sub-module devices is achieved under the condition that the output waveform of the MMC is not changed, so that the top layer control ofan MMC system is not affected; and the method does not need to add an additional power device, is suitable for the most basic half-bridge sub-module topology, is not limited by the topology, can realize loss balance in a full power factor range from -pi / 2 to pi / 2, and is rich in application scenarios.

Description

technical field [0001] The invention belongs to the field of voltage converters, and more specifically relates to a method for equalizing the loss of SiC MOS MMC sub-module devices. Background technique [0002] Modular Multilevel Converter (MMC) has broad application prospects in DC transmission, motor drive, and renewable energy integration due to its good modularity, flexible scalability, and good waveform quality. . In order to adapt to the operation requirements of complex application scenarios and environments, the efficiency, cost, and environmental adaptability requirements of MMC are gradually increased. At present, Si-based devices are generally used as switching devices in MMC sub-modules. However, traditional Si-based devices belong to the first generation of devices, which have high losses and are difficult to operate in a high temperature environment above 125°C. It is difficult to further improve the transmission efficiency and need to sacrifice a lot of volu...

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Application Information

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IPC IPC(8): H02M7/219
CPCH02M7/219H02M1/0051H02M1/0054Y02B70/10
Inventor 林磊殷天翔
Owner HUAZHONG UNIV OF SCI & TECH