Copper-clad plate and preparation method thereof

A technology of copper clad laminate and copper foil, which is applied in chemical instruments and methods, other household appliances, synthetic resin layered products, etc., can solve the problems of high cost, achieve high yield, easy control, and reduce the width of rolls.

Inactive Publication Date: 2020-09-04
AAC TECH PTE LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0009] The purpose of the present invention is to provide a copper clad laminate and its preparation method to solve the technical problem of high cost in the prior art

Method used

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  • Copper-clad plate and preparation method thereof
  • Copper-clad plate and preparation method thereof
  • Copper-clad plate and preparation method thereof

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preparation example Construction

[0029] Embodiments of the present invention provide a method for preparing a copper clad laminate, such as figure 1 Shown include the following steps:

[0030] S01: pass one side or both sides of the liquid crystal polymer (LCP) film and the copper foil through the heating roller at the same speed for the first heat press treatment;

[0031] S02: Attach a high-temperature protective film to both sides of the semi-finished copper-clad laminate, and then perform high-temperature flat-plate hot-pressing treatment;

[0032] S03: Recover the high temperature protective film to obtain the copper clad laminate.

[0033] In a preferred embodiment, the first heat and pressure treatment also includes a preheat treatment of the LCP film. Before the hot pressing treatment, the LCP film can be preheated and softened to facilitate the subsequent hot pressing treatment.

[0034] In a further preferred embodiment, the temperature of the preheating treatment is 100-150°C. Heating and soft...

Embodiment 1-9

[0051] The LCP film with a thickness of 100 μm is sent to the preheating device for preheating treatment through the conveying device, and then the first hot-pressing treatment is performed with the ED copper foil with a thickness of 18 μm and a roughness of 1.3 μm, and then cut to obtain a semi-finished copper clad laminate.

[0052] Cover the semi-finished copper-clad laminate with a protective film, wherein the protective film described in the embodiment 1-2 adopts aluminum foil; embodiment 3-4 adopts copper foil; embodiment 5-7 adopts PI; embodiment 8-9 adopts PTFE; and then proceed sequentially Low-temperature hot-pressing treatment and high-temperature hot-pressing treatment; finally, the protective film is recovered to obtain the copper clad laminates of each embodiment. Each of the above process conditions corresponds to that in Table 1.

[0053] The peeling force and thickness uniformity of the copper clad laminates in each embodiment were tested to obtain the data in...

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Abstract

The invention provides a preparation method of a copper-clad plate, which is characterized by comprising the following steps: carrying out primary hot-pressing treatment on one side or two sides of aliquid crystal polymer (LCP) film and copper foil at a constant speed through a heating roller; cutting the LCP film subjected to the first hot-pressing treatment to obtain a semi-finished copper-cladplate; attaching high-temperature protective films to the two sides of the semi-finished copper-clad plate, and then performing high-temperature flat plate hot-pressing treatment; and recovering thehigh-temperature protective film to obtain the copper-clad plate. The preparation method of the copper-clad plate has the advantages of higher yield and lower process cost, and is suitable for large-scale popularization and application.

Description

【Technical field】 [0001] The invention belongs to the field of electronic component processing, and in particular relates to a copper clad laminate and a preparation method thereof. 【Background technique】 [0002] In recent years, with the rapid development of the electronics industry, printed circuit boards (Printed Circuit Board, PCB for short) have played a key role in connecting and supporting electronic components, and copper clad laminates (CCL) are the basic materials of circuit boards. Therefore, it is widely used in many electronic products. [0003] According to the different substrates in the copper clad laminate, it can usually be divided into rigid copper clad laminates that are not easy to bend and bendable flexible copper clad laminates. One of the more prominent advantages of bendable flexible copper clad laminates is that it can reduce the volume of equipment and weight. [0004] Wearable and portable smart devices have become an indispensable necessity in...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B32B15/08B32B15/20B32B27/06B32B27/28B32B27/32B32B37/00B32B37/06B32B37/10B32B38/00B32B38/04
CPCB32B15/08B32B15/20B32B27/06B32B27/281B32B27/322B32B37/0053B32B37/06B32B37/10B32B38/00B32B38/04B32B2038/045B32B2307/20B32B2307/306B32B2307/50B32B2307/734B32B2457/08
Inventor 霍雷王和志
Owner AAC TECH PTE LTD
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