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Packaging structure of MEMS microphone and combined sensor thereof

A combined sensor and packaging structure technology, applied in the direction of sensors, electrostatic sensors, sensor types, etc., can solve the problems of single function of MEMS microphone, affecting the performance of MEMS microphone, and small back cavity volume

Pending Publication Date: 2020-09-04
路溱微电子技术(苏州)有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] However, the traditional MEMS microphone has a single function and its back cavity is small, which affects the performance of the MEMS microphone

Method used

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  • Packaging structure of MEMS microphone and combined sensor thereof
  • Packaging structure of MEMS microphone and combined sensor thereof
  • Packaging structure of MEMS microphone and combined sensor thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0029] like figure 1 As shown, a package structure of a MEMS microphone and its combination sensor, the package structure includes a substrate 1, a housing 2, a MEMS sensor 3, a MEMS microphone 4 and a microphone ASIC chip 5;

[0030] The MEMS sensor 3 is flip-chip soldered on the substrate 1 through solder balls 6, and the MEMS microphone 4 is glued on the MEMS sensor 3;

[0031] The microphone ASIC chip 5 is fixedly installed on the substrate 1, and is electrically connected with the MEMS microphone 4 through a metal wire;

[0032] The shell 2 packages the MEMS sensor 3, the MEMS microphone 4 and the microphone ASIC chip 5 on the substrate 1;

[0033] The package structure is provided with a sound hole 7 for sound penetration.

[0034] Wherein, the MEMS sensor 3 is an integrated MEMS sensor.

[0035] Wherein, several sound holes 7 are opened in total, and several sound holes 7 are distributed on the shell 2 in an array.

Embodiment 2

[0037] like figure 2 As shown, the difference from Embodiment 1 is that the back of the MEMS sensor 3 has a back cavity.

Embodiment 3

[0039] like image 3 and Figure 4 As shown, different from Embodiment 1 and Embodiment 2, the MEMS sensor 3 is a separate MEMS sensor, including a MEMS sensor body 31 and a MEMS sensor ASIC chip 32;

[0040] The MEMS microphone 4 is glued on the MEMS sensor body 31 , and the MEMS sensor ASIC chip 32 is welded on the substrate 1 at a position below the microphone ASIC chip 5 , and glued to the microphone ASIC chip 5 .

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Abstract

The invention discloses a packaging structure of an MEMS microphone and a combined sensor thereof, and belongs to the field of MEMS microphone packaging. The packaging structure comprises a substrate,a shell, an MEMS sensor, an MEMS microphone and a microphone ASIC chip; the MEMS sensor is welded on the substrate in an inverted manner through a welding ball, and the MEMS microphone is glued on the MEMS sensor; the microphone ASIC chip is fixedly installed on the substrate and is electrically connected with the MEMS microphone through a metal wire; the MEMS sensor, the MEMS microphone and themicrophone ASIC chip are packaged on the substrate by the shell; the packaging structure is provided with a sound hole for sound penetration. Functional integration of the MEMS microphone and the MEMSsensor can be effectively achieved in a small space, the sensitivity, the signal-to-noise ratio and other performance of the MEMS microphone can be effectively improved, and the packaging cost of theMEMS microphone is reduced.

Description

technical field [0001] The invention belongs to the technical field of MEMS microphone packaging, and in particular relates to a packaging structure of a MEMS microphone and a combined sensor. Background technique [0002] MEMS microphone is a microphone based on MEMS technology. Simply put, a capacitor is integrated on a micro-silicon chip. It can be manufactured by surface mount technology, can withstand high reflow temperature, and is easy to integrate with CMOS technology and other audio circuits. , and has improved noise cancellation performance and good RF and EMI suppression capabilities, the full potential of MEMS microphones has yet to be tapped, but products using this technology have shown many advantages in a variety of applications, especially mid-to-high-end mobile phones in application. [0003] However, the traditional MEMS microphone has a single function and its back cavity is small, which affects the performance of the MEMS microphone. Contents of the i...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H04R19/00H04R19/04
CPCH04R19/005H04R19/04H04R2201/003
Inventor 王志
Owner 路溱微电子技术(苏州)有限公司