A kind of preparation method of high-performance modified polyimide flexible composite film

Abstract

The invention discloses a method for preparing a high-performance modified polyimide flexible composite film. Modified polyimide (MPI) glue and performance enhancing components are added to an organic solvent, pretreated, and ground to prepare MPI glue is formed, and then the MPI glue is coated or sputtered on the polymer film, and then pre-cured, post-cured, and tempered to obtain a high-performance MPI flexible composite film. The composite film prepared by the present invention has a lower dielectric constant, dielectric loss and moisture absorption rate, which can meet the high-frequency and high-speed requirements in 5G applications; and has better high-voltage insulation, mechanical strength and toughness; and the preparation The process is simple, and the yield rate is as high as 92%, which meets the needs of various process windows and low-cost production.

Description

technical field [0001] The invention belongs to the technical field of electronic materials, and particularly relates to a preparation method of a high-performance modified polyimide flexible composite film. Background technique [0002] With the rapid development of the electronics industry, electronic devices such as personal computers, mobile phones, servers, GPS navigation devices and other household electronic devices are becoming more and more popular. More and more powerful, the current electronic and electrical equipment is developing towards "thinning" and "miniaturization". Flexible composite film is an essential core component in the field of electronic circuits, and products are limited by RoHS and REACH, etc. Environmental regulations also put forward higher requirements for the flexible composite film as the core component, which is embodied in: ① the current conventional flexible composite film / dielectric constant (Dk), dielectric loss (Df) and moisture abso...

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Problems solved by technology

[0002] With the rapid development of the electronics industry, electronic devices such as personal computers, mobile phones, servers, GPS navigation devices and other household electronic devices are becoming more and more popular. At the same time, electronic devices are getting smaller and smaller, with more and more functions. More and more powerful, making the current electronic and electrical equipment develop towards "thinning" and "miniaturization". Flexible composite film is an indispensable core component in the field of electronic circuits, and the products are restricted by RoHS and REACH, etc. Environmental protection regulations also put forward higher requirements for the flexible composite film as the core component, as shown in: ①The current conventional flexible composite film / dielectric constant (Dk), dielectric loss (Df) and moisture absorption High rate, unable to meet the high-frequency and high-speed requirements in 5G applications; ②Insufficient high-voltage insulation performance, unable to meet high-voltage insulation and high current carrying requirements, especially in the application of ultra-thin insulating films (≦5um); ③Mechanical strength Insufficient toughness and toughness, it is impossible to make ultra-thin film (≦5um), and it is easy to break and bend less than thin film (≦10um), and the film forming process is complicated, the production efficiency is low, the production yield is low, and the cost is high; ④ Preparation The process is complex, the yield rate is high and the cost is high, and it cannot meet the requirements of wide process window (such as medium and low temperature, medium and low pressure process) and low equipment investment and low processing cost

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