Preparation method of high-performance modified polyimide flexible composite film

Abstract

The invention discloses a preparation method of a high-performance modified polyimide flexible composite film. The preparation method comprises the following steps: adding a modified polyimide (MPI) adhesive and a performance enhancing component into an organic solvent, carrying out pretreatment and grinding to prepare MPI adhesive, coating or sputtering the MPI adhesive onto a polymeric membrane,and carrying out pre-curing, post-curing and tempering treatment processes to obtain the high-performance MPI flexible composite film. The composite film prepared by the method has relatively low dielectric constant, dielectric loss and moisture absorption rate, and can meet the high-frequency and high-speed requirements in 5G application, and good high-voltage-resistant insulativity, mechanicalstrength and toughness are achieved; and the preparation process is simple, the yield is up to 92% or above, and the requirements of various process windows and low-cost production are met.

Description

technical field [0001] The invention belongs to the technical field of electronic materials, and in particular relates to a preparation method of a high-performance modified polyimide flexible composite film. Background technique [0002] With the rapid development of the electronics industry, electronic devices such as personal computers, mobile phones, servers, GPS navigation devices and other household electronic devices are becoming more and more popular. At the same time, electronic devices are getting smaller and smaller, with more and more functions. More and more powerful, making the current electronic and electrical equipment develop towards "thinning" and "miniaturization". Flexible composite film is an indispensable core component in the field of electronic circuits, and the products are restricted by RoHS and REACH, etc. Environmental protection regulations also put forward higher requirements for the flexible composite film as the core component, as shown in: ①T...

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Problems solved by technology

[0002] With the rapid development of the electronics industry, electronic devices such as personal computers, mobile phones, servers, GPS navigation devices and other household electronic devices are becoming more and more popular. At the same time, electronic devices are getting smaller and smaller, with more and more functions. More and more powerful, making the current electronic and electrical equipment develop towards "thinning" and "miniaturization". Flexible composite film is an indispensable core component in the field of electronic circuits, and the products are restricted by RoHS and REACH, etc. Environmental protection regulations also put forward higher requirements for the flexible composite film as the core component, as shown in: ①The current conventional flexible composite film / dielectric constant (Dk), dielectric loss (Df) and moisture absorption High rate, unable to meet the high-frequency and high-speed requirements in 5G applications; ②Insufficient high-voltage insulation performance, unable to meet high-voltage insulation and high current carrying requirements, especially in the application of ultra-thin insulating films (≦5um); ③Mechanical strength Insufficient toughness and toughness, it is impossible to make ultra-thin film (≦5um), and it is easy to break and bend less than thin film (≦10um), and the film forming process is complicated, the production efficiency is low, the production yield is low, and the cost is high; ④ Preparation The process is complex, the yield rate is high and the cost is high, and it cannot meet the requirements of wide process window (such as medium and low temperature, medium and low pressure process) and low equipment investment and low processing cost

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