Preparation method of high-performance modified polyimide (MPI) flexible substrate

Abstract

The invention discloses a preparation method of a high-performance modified polyimide (MPI) flexible substrate. An MPI adhesive and performance strengthening components are added into an organic medium solvent, MPI glue is prepared by grinding after pretreatment, then metal foil is coated with the MPI glue or the MPI glue is sputtered on the metal foil, then precuring, postcuring and tempering treatment processes are carried out, and thus the high-performance MPI flexible substrate is obtained. A composite film prepared by the preparation method has the low dielectric constant, dielectric lossand moisture absorption rate, and can meet the high-frequency and high-speed requirements in 5G application; good high-voltage insulation resistance, mechanical strength and toughness are realized; and the preparation process is simple, the yield is up to 92% or above, and the demands of various process windows and low-cost production are met.

Description

technical field [0001] The invention belongs to the technical field of electronic materials, and in particular relates to a method for preparing a high-performance modified polyimide flexible substrate. Background technique [0002] With the rapid development of the electronics industry, electronic devices such as personal computers, mobile phones, servers, GPS navigation devices and other household electronic devices are becoming more and more popular. At the same time, electronic devices are getting smaller and smaller, with more and more functions. It is becoming more and more powerful, which makes the current electronic and electrical equipment develop towards "thinning" and "miniaturization". Flexible substrates are an indispensable core component in the field of electronic circuits, and the products are restricted by environmental protection such as RoHS and REACH. Regulations also put forward higher requirements for flexible substrates as core components, as shown in:...

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Problems solved by technology

[0002] With the rapid development of the electronics industry, electronic devices such as personal computers, mobile phones, servers, GPS navigation devices and other household electronic devices are becoming more and more popular. At the same time, electronic devices are getting smaller and smaller, with more and more functions. It is becoming more and more powerful, which makes the current electronic and electrical equipment develop towards "thinning" and "miniaturization". Flexible substrates are an indispensable core component in the field of electronic circuits, and the products are restricted by environmental protection such as RoHS and REACH. Regulations also put forward higher requirements for flexible substrates as core components, as shown in: ①The current conventional flexible substrates have relatively high dielectric constant (Dk), dielectric loss (Df) and moisture absorption , unable to meet the high-frequency and high-speed requirements in 5G applications; ② Insufficient high-voltage insulation performance, unable to meet high-voltage insulation and high current carrying requirements, especially in the application of ultra-thin insulating films (≦5um); ③ Insufficient mechanical strength and toughness , cannot be made into ultra-thin films (≦5um), and are easy to break and have poor bendability compared with thin films (≦10um), and the film-forming process is complicated, the production efficiency is low, the production yield is low, and the cost is high; ④The preparation process is complex, The yield rate is high and the cost is high, which cannot meet the requirements of wide process window (such as medium and low temperature, medium and low pressure process) and low equipment investment and low processing cost

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