A preparation method of high-performance modified polyimide flexible substrate

Abstract

The invention discloses a method for preparing a high-performance modified polyimide flexible substrate. Modified polyimide (MPI) glue and performance-enhancing components are added to an organic solvent, pretreated, and ground to produce MPI glue, and then apply or sputter the MPI glue on the metal foil, and then perform pre-curing, post-curing, and tempering processes to obtain a high-performance MPI flexible substrate. The composite film prepared by the present invention has a lower dielectric constant, dielectric loss and moisture absorption rate, which can meet the high-frequency and high-speed requirements in 5G applications; and has better high-voltage insulation, mechanical strength and toughness; and the preparation The process is simple, and the yield rate is as high as 92%, which meets the needs of various process windows and low-cost production.

Description

technical field [0001] The invention belongs to the technical field of electronic materials, and particularly relates to a preparation method of a high-performance modified polyimide flexible substrate. Background technique [0002] With the rapid development of the electronics industry, electronic devices such as personal computers, mobile phones, servers, GPS navigation devices and other household electronic devices are becoming more and more popular. More and more powerful, the current electronic and electrical equipment is developing towards "thinning" and "miniaturization". The flexible substrate is an essential core component in the field of electronic circuits, and the products are limited by environmental protection such as RoHS and REACH. Regulations have also put forward higher requirements for flexible substrates as core components, which are embodied in: ① The current conventional flexible substrates have high dielectric constant (Dk), dielectric loss (Df) and mo...

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Problems solved by technology

[0002] With the rapid development of the electronics industry, electronic devices such as personal computers, mobile phones, servers, GPS navigation devices and other household electronic devices are becoming more and more popular. At the same time, electronic devices are getting smaller and smaller, with more and more functions. It is becoming more and more powerful, which makes the current electronic and electrical equipment develop towards "thinning" and "miniaturization". Flexible substrates are an indispensable core component in the field of electronic circuits, and the products are restricted by environmental protection such as RoHS and REACH. Regulations also put forward higher requirements for flexible substrates as core components, as shown in: ①The current conventional flexible substrates have relatively high dielectric constant (Dk), dielectric loss (Df) and moisture absorption , unable to meet the high-frequency and high-speed requirements in 5G applications; ② Insufficient high-voltage insulation performance, unable to meet high-voltage insulation and high current carrying requirements, especially in the application of ultra-thin insulating films (≦5um); ③ Insufficient mechanical strength and toughness , cannot be made into ultra-thin films (≦5um), and are easy to break and have poor bendability compared with thin films (≦10um), and the film-forming process is complicated, the production efficiency is low, the production yield is low, and the cost is high; ④The preparation process is complex, The yield rate is high and the cost is high, which cannot meet the requirements of wide process window (such as medium and low temperature, medium and low pressure process) and low equipment investment and low processing cost

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