Transmission line structure and manufacturing method thereof
A technology of transmission line structure and manufacturing method, which is applied in the fields of printed circuit manufacturing, conductive pattern layout details, printed circuit components, etc. It can solve the problem of signal transmission loss that cannot meet the high frequency and high speed of the transmission line structure, and cannot meet the requirements of thinness or flexure. Thickness and other problems, to achieve the effect of improving reliability, preventing oxidation, and reducing transmission loss
Active Publication Date: 2022-02-22
HONGQISHENG PRECISION ELECTRONICS (QINHUANGDAO) CO LTD +1
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Problems solved by technology
In the prior art, materials with low dielectric loss are usually used as the base material to form a cavity to suspend the signal line. The signal transmission loss of the transmission line structure thus prepared cannot meet people's requirements for high frequency and high speed of the transmission line structure.
And the thickness of the product is too large to meet the needs of thinness or flexure
Method used
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[0042] In order to further illustrate the technical means and effects that the present invention takes to reach the intended purpose of the invention, the following in conjunction with the appended Figure 1-21 And the preferred implementation mode, the specific implementation mode, structure, features and effects of the transmission line structure and its manufacturing method provided by the present invention are described in detail as follows. Apparently, the described embodiments are only some of the embodiments of the present invention, but not all of them. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.
[0043] It should be noted that when an element is considered to be "connected" to another element, it may be directly connected to the other element or there may be an intervening element at the same time. Whe...
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A transmission line structure comprises a cable line layer, a bonding layer, a first protection layer and a second protection layer. The cable line layer comprises grounding lines and a signal line, and the grounding lines are located on the two sides of the signal line; the signal line is thinner than the grounding lines; there is a height difference between the grounding lines and the signal line; the bonding layer fills the space between the grounding lines and the signal line; the first protection layer formed on the grounding lines and the bonding layer; a first cavity is defined by the bonding layer, the signal line and the first protection layer, and the first cavity is filled with air or is vacuum; the second protection layer is formed on the grounding lines and the bonding layer; and a second cavity is defined by the bonding layer, the signal line and the second protection layer, and the second cavity is filled with air or is vacuum. The invention further relates to a manufacturing method of the transmission line structure. The transmission line structure provided by the invention is small in transmission loss, and can meet the requirements for high frequency and high speed.
Description
technical field [0001] The invention relates to the technical field of circuit boards, in particular to a transmission line structure and a manufacturing method thereof. Background technique [0002] Printed circuit boards are the blood of electronic equipment. With the advent of the 5G era, high frequency and high speed are the permanent technical pursuit of printed circuit boards. Usually, the transmission of electronic signals in the line will cause transmission loss. The speed of electrical signal transmission is inversely proportional to the square root of the dielectric constant. The lower the dielectric constant, the faster the signal transmission speed. For high-speed printed circuit boards, it is necessary to consider whether the material selection and design meet the signal integrity requirements during design, which requires minimizing the signal transmission loss. Signal transmission loss is mainly dielectric loss and conductor loss. Among them, the dielectric ...
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IPC IPC(8): H05K1/02H05K3/18
CPCH05K1/0296H05K3/188H05K2201/02H05K2201/09209Y02A30/00
Inventor 李成佳王建
Owner HONGQISHENG PRECISION ELECTRONICS (QINHUANGDAO) CO LTD