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Resin composition, preg, laminated board, preg production method, laminated board production method and use of laminated board

A technology of resin composition and prepreg, which is applied in the field of communication materials, can solve the problems of reduced electrical insulation performance, poor thermal conductivity, and heat dissipation performance that cannot meet the heat dissipation requirements of high-power devices, so as to achieve low dielectric loss and meet the needs of high-frequency communication. Effect

Active Publication Date: 2020-09-08
AAC TECH NANJING
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the thermal conductivity of epoxy resin and glass fiber cloth is poor, and the general thermal conductivity of FR-4 is only 0.25W/(m.K)
Therefore, its heat dissipation performance can no longer meet the heat dissipation requirements of current high-power devices.
[0004] One of the existing methods to solve this problem is to prepare high thermal conductivity FR-4. At present, the most commonly used method to prepare high thermal conduc

Method used

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  • Resin composition, preg, laminated board, preg production method, laminated board production method and use of laminated board
  • Resin composition, preg, laminated board, preg production method, laminated board production method and use of laminated board

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preparation example Construction

[0052] The preparation method of above-mentioned prepreg comprises the following processes:

[0053] The above resin composition is dissolved in a solvent to form a glue solution, and then the reinforcing material is immersed in the glue solution, and the impregnated reinforcing material is heated to make it semi-cured to form a prepreg.

[0054] The invention also discloses a laminated board, which comprises the above-mentioned prepreg and conductive metal sheets stacked on one or both sides of the prepreg. The prepreg can be one, or two or more prepregs stacked in sequence.

[0055] Preferably, the conductive metal sheet is copper foil.

[0056] The preparation method of above-mentioned laminated board comprises the following processes:

[0057] One or both sides of the above-mentioned prepreg are covered with a conductive metal sheet, and then laminated to form a laminated board. The prepreg can be a prepreg, or two or more laminated boards stacked in sequence.

[0058]...

Embodiment 1

[0061] The resin composition comprises the following components in parts by weight:

[0062] 12 parts of methacrylic polyphenylene ether resin (trade name SA9000), 10 parts of butadiene-styrene copolymer resin, 2 parts of polybutadiene resin, styrene-butadiene-styrene triblock copolymer 1 part (SBS resin), 13 parts of boron nitride (BN), 8 parts of modified fused silica, 3.5 parts of decabromodiphenyl ether flame retardant, 1.5 parts of vinyltrimethylsiloxane, 1 part of tert-butyl peroxide diisopropylbenzene (BIPB) initiator.

[0063] Prepare the prepreg:

[0064] 1) Weigh each component according to the above parts by weight.

[0065] 2) Put the methacrylic polyphenylene ether resin into the rubber mixing bottle, then add 32 parts of solvent toluene and 17 parts of butanone into the rubber mixing bottle, and stir until the methacrylic polyphenylene ether resin is completely dissolved.

[0066] 3) Add butadiene-styrene copolymer resin, polybutadiene resin and dissolved SBS ...

Embodiment 2

[0074] The only difference between Example 2 and Example 1 is that the resin composition is different, and the preparation methods and parameters of the prepreg and the copper-clad laminate are the same as those of Example 1.

[0075] In this embodiment, the resin composition includes the following components in parts by weight:

[0076] 12 parts of methacrylic polyphenylene ether resin (trade name SA9000), 10 parts of butadiene-styrene copolymer resin, 2 parts of polybutadiene resin, styrene-butadiene-styrene triblock copolymer 1 part (SBS resin), 8 parts of boron nitride (BN), 13 parts of modified fused silica, 3.5 parts of decabromodiphenyl ether flame retardant, 1.5 parts of vinyltrimethylsiloxane, two 1 part of tert-butyl peroxide diisopropylbenzene (BIPB) initiator.

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Abstract

The invention provides a resin composition, a prepreg, a laminated board, a preparation method of the prepreg, a preparation method of the laminated board and application of the laminated board. The resin composition is prepared from the following components in parts by weight: 20-40 parts of a hydrocarbon resin containing C-C unsaturated bonds, 10-40 parts of a heat-conducting filler, 1-3 parts of a silane coupling agent and 0.1-10 parts of an initiator, wherein the heat-conducting filler is selected from one, two or more of silicon dioxide, silicon carbide, aluminum oxide, aluminum nitride,magnesium aluminum oxide, boron nitride or titanium dioxide. According to the invention, the prepreg and the laminated board are prepared from the resin composition; and the prepreg and the laminatedboard have high thermal conductivity and low dielectric loss, can be applied to a circuit board, and are particularly suitable for being applied to a circuit board of high-frequency 5G communication equipment.

Description

【Technical field】 [0001] The invention relates to the field of communication materials, in particular to a resin composition, a prepreg, a laminate, a preparation method of the prepreg, a preparation method of the laminate and an application thereof. 【Background technique】 [0002] 5G communication technology is the fifth-generation technology of mobile communication technology, which is developed to meet the needs of mobile Internet and Internet of Everything business after 2020. Compared with 4G communication technology, 5G communication technology has the characteristics of faster information transmission rate, stronger spectrum utilization efficiency, lower delay, more reliable information transmission and higher link density. [0003] In the field of 5G antenna applications, higher frequency and interconnection density require the circuit board substrate used to have a more stable dielectric constant, lower dielectric loss and efficient heat dissipation. For commonly u...

Claims

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Application Information

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IPC IPC(8): C08L71/12C08L47/00C08L53/02C08K3/38C08K13/06C08K3/36C08K5/06C08K5/5425C08K7/14B32B17/02B32B17/12B32B15/20B32B15/14B32B37/06B32B37/10B32B38/00B32B27/04
CPCC08L71/12B32B5/02B32B5/26B32B15/20B32B15/14B32B37/06B32B37/1009B32B38/0036C08K2003/385C08L2205/035C08L2205/025C08L2203/20B32B2038/0076B32B2262/101B32B2260/021B32B2260/046C08L47/00C08L53/02C08K3/38C08K13/06C08K3/36C08K5/06C08K5/5425C08K7/14
Inventor 夏克强王和志张鹏
Owner AAC TECH NANJING
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