cleaning equipment

Abstract

The present invention provides a cleaning device, including a cleaning chamber, an air intake device, a limiting structure and a ventilation structure, wherein the air inlet device is used to deliver dry gas into the cleaning chamber, and the limiting structure is arranged in the cleaning chamber. It is used to fix the wafer when the wafer is in the drying position; the ventilation structure is arranged on the limiting structure, and is used to make the drying gas flow to the wafer through the limiting structure. The cleaning equipment provided by the invention can improve the drying effect of wafers, reduce wafer defects, shorten drying time, improve drying efficiency, and has simple structure, low manufacturing cost and high reliability.

Description

technical field [0001] The present invention relates to the technical field of semiconductor equipment, in particular, to a cleaning equipment. Background technique [0002] At present, in the semiconductor process, it is usually necessary to clean the wafer to remove the contaminants attached to the wafer during the process, and to clean the wafer after cleaning to prevent the surface of the cleaned wafer from adhering to the cleaning agent. [0003] In the prior art, the cleaning chamber is provided with a carrying table, a lifting mechanism, an air cylinder and two clamping plates, wherein the two clamping plates are respectively arranged on both sides of the cleaning chamber, and a plurality of clamping plates are arranged in the clamping plate. The card slot, the air cylinder is used to control the distance between the two card plates, in the process of cleaning the wafer, the wafer is placed in the carrier device, the carrier device with the wafer is placed on the carr...

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Problems solved by technology

[0004] However, in the prior art, the edge of the wafer is stuck in the clamping groove of the clamping plate, which is difficult to be completely dried, and the drying gas can only diffuse to the wafer from between the two clamping plates, so that the flow rate of the drying gas to the wafer Low, resulting in a long drying time, the wafer is difficult to be completely dried, so that after the wafer is dried, there will still be more cleaning agent, resulting in more defects. Moreover, two clamping plates are arranged on both sides of the cleaning chamber, and an air cylinder is required Auxiliary, making the cleaning chamber complex structure, high manufacturing cost, low reliability

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